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ST0159C Lanthanum Calcium Manganate Sputtering Targets

Lanthanum Calcium Manganate (LaCaMnO₃) Sputtering Target

Introduction

Lanthanum Calcium Manganate (LaCaMnO₃) Sputtering Targets are advanced ceramic oxide materials widely used in thin film research, functional coatings, and electronic device development. Known for their colossal magnetoresistance (CMR), mixed ionic–electronic conductivity, and tunable electronic phases, LaCaMnO₃ targets are a vital resource for fabricating thin films in spintronics, oxide electronics, and energy-related applications.

Detailed Description

Lanthanum Calcium Manganate sputtering targets are typically produced via high-purity powder synthesis followed by hot pressing or sintering, resulting in dense, crack-free ceramic targets.

Key features include:

  • High Purity (≥99.9%) – ensures minimal impurities and reproducible thin film properties.

  • Perovskite Structure – enables phase transitions and functional electronic behavior.

  • Colossal Magnetoresistance (CMR) – strong change in resistance under a magnetic field, useful in spintronics.

  • Stable Microstructure – supports uniform sputtering rates and long service life.

  • Custom Options – available in different La:Ca ratios (e.g., La₀.₇Ca₀.₃MnO₃) tailored to research needs.

Applications

Lanthanum Calcium Manganate sputtering targets are widely used in:

  • Spintronics – thin films for magnetic sensors and memory devices.

  • Oxide Electronics – functional layers in complex oxide heterostructures.

  • Solid Oxide Fuel Cells (SOFCs) – potential electrode or interfacial material.

  • Thin Film Research – studies on magnetoresistance and phase transitions.

  • Energy & Sensor Devices – coatings for electrochemical and sensing applications.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures reproducible film quality
CompositionLa₁₋ₓCaₓMnO₃ (x = 0.2 – 0.5 typical)Determines electronic & magnetic properties
Diameter25 – 150 mm (customizable)Fits common sputtering systems
Thickness3 – 10 mmAffects deposition stability
BondingIndium / Elastomer / Copper backingEnhances thermal management

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Lanthanum Calcium ManganateColossal magnetoresistance, perovskiteSpintronics, oxide thin films
Lanthanum Strontium Manganate (LSMO)High conductivity, stable structureElectrodes, ferroelectrics
Lanthanum Aluminate (LAO)Excellent substrate materialOxide heterostructures

FAQ

QuestionAnswer
Can the La:Ca ratio be customized?Yes, different stoichiometries (e.g., La₀.₇Ca₀.₃MnO₃) are available.
Which industries use LaCaMnO₃ targets most?Spintronics, advanced electronics, and R&D institutions.
How is the target packaged?Each target is vacuum-sealed, foam-cushioned, and shipped in export-safe cartons or wooden crates.
Is bonding necessary?For high-power sputtering, indium or elastomer bonding is recommended.
What deposition methods are suitable?Primarily RF and DC magnetron sputtering.

Packaging

Lanthanum Calcium Manganate sputtering targets are vacuum-sealed with moisture protection, individually labeled for traceability, and packaged in foam-lined export cartons or wooden crates to ensure safe delivery.

Conclusion

Lanthanum Calcium Manganate (LaCaMnO₃) Sputtering Targets are indispensable materials for cutting-edge research in spintronics, oxide electronics, and energy devices. With high purity, customizable compositions, and excellent sputtering performance, they provide researchers and industry professionals with reliable solutions for advanced thin film deposition.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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