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ST0159C Lanthanum Calcium Manganate Sputtering Targets

MSDS File
Material TypeLanthanum Calcium Manganate
SymbolLa1-xCaxMnO3, LCMO
Color/AppearanceVarious colors, Solid
Melting Point (°C)N/A
Relative Density (g/cc)>90%
Z RatioN/A
SputterRF, RF-R, DC
Max Power Density*
(Watts/Square Inch)		N/A
Type of BondIndium, Elastomer

Lanthanum Calcium Manganate Sputtering Targets

Overview

Lanthanum Calcium Manganate (La₀.₇Ca₀.₃MnO₃) is a compound known for its remarkable properties, including the ability to maintain magnetic polarons at elevated temperatures when subjected to high doses of electron irradiation. This material is widely used in various industries, including antimicrobial drugs, fuel cells, metal-air batteries, and water purification technology. While noncombustible, Lanthanum Calcium Manganate is a powerful oxidizing agent and is highly sensitive to oxygen levels.

Lanthanum Calcium Manganate Sputtering Targets Information

  • Purity: 99.9%
  • Available Shapes:
    • Circular: Diameter ≤ 14 inches, Thickness ≤ 15 mm
    • Block: Length ≤ 120 ± 0.1 mm, Width ≤ 120 ± 0.1 mm, Thickness ≤ 15 mm
  • Bonding: Indium, Elastomer
  • Sputtering Methods: RF, RF-R, DC
  • Thermal Considerations: Targets with low thermal conductivity may require special ramp-up and ramp-down procedures to prevent thermal shock during sputtering. Bonding is recommended for enhanced performance and to mitigate brittleness.

Applications of Lanthanum Calcium Manganate Sputtering Targets

  • Catalysts
  • Superconducting Materials
  • Solid Oxide Fuel Cell Cathodes
  • Supercapacitors
  • Ferroelectric Storage

Features

  • High Purity & Density: Ensures reliable performance and quality.
  • Custom Sizes Available: Tailored to meet the specific needs of your application.
  • Single Phase Composition: Guarantees uniform material properties for consistent results.

Manufacturing Process

  • Powder Synthesis: High-purity metal oxide precursor materials are used in-house for optimal material quality.
  • High-Energy Mixing & Particle Sizing: Ensures consistency and uniformity in the sputtering target.
  • Densification & Sintering: Proprietary multi-step processes for enhanced target density and material strength.
  • Cleaning & Packaging: Targets are thoroughly cleaned and packaged to ensure protection from environmental contaminants during shipment.

Options Available

  • Purity: 99.9% minimum purity for superior consistency.
  • Custom Compositions: Available upon request for specialized applications.
  • Smaller Sizes for R&D: Ideal for research and development projects.
  • Sputtering Target Bonding Service: Available for improved target performance and durability.

For more information or inquiries, please contact us directly.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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