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LiNi₀.₅Mn₁.₅O₄ Sputtering Target

ST0163Q LiNi₀.₈Co₀.₁₅Al₀.₀₅O₂ Sputtering Target

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LiNi₀.₈Co₀.₁₅Al₀.₀₅O₂ Sputtering Target Description

TFM provides LiNi₀.₈Co₀.₁₅Al₀.₀₅O₂ sputtering targets (commonly known as NCA targets) for advanced thin film deposition applications in battery research and energy storage technologies. These high-purity ceramic targets are optimized for the production of lithium-ion battery cathode thin films via sputtering techniques such as RF or DC magnetron sputtering.

LiNi₀.₈Co₀.₁₅Al₀.₀₅O₂, or NCA, is a layered oxide material featuring high nickel content with minor cobalt and aluminum doping. This composition delivers high energy density, good rate capability, and improved thermal stability. It is widely used in electric vehicle battery cathodes and next-generation solid-state battery architectures.

In sputtering applications, NCA targets provide uniform thin films suitable for research into microbattery development, solid-state battery cathodes, and performance coatings for electrochemical devices.

LiNi₀.₈Co₀.₁₅Al₀.₀₅O₂ Sputtering Target Specification

PropertyValue
Chemical FormulaLiNi₀.₈Co₀.₁₅Al₀.₀₅O₂
Common NameNCA
Purity≥ 99.9% (3N)
AppearanceGray or black sintered ceramic
Crystal StructureLayered α-NaFeO₂ type
Density~4.6–4.8 g/cm³
Melting PointDecomposes before melting
Available SizesDia.: 1″, 2″, 3″, 4″
Thick: 0.125″, 0.250″ (custom sizes available)
FormSintered ceramic target, optionally bonded to backing plate

LiNi₀.₈Co₀.₁₅Al₀.₀₅O₂ Sputtering Target Handling Notes

  1. Elastomer bonding is recommended for NCA targets to improve mechanical stability and prevent cracking during sputtering.

  2. Avoid rapid temperature changes to minimize thermal stress.

  3. Handle with clean gloves in dry, inert atmosphere to prevent surface contamination and moisture uptake.

LiNi₀.₈Co₀.₁₅Al₀.₀₅O₂ Sputtering Target Packaging

TFM carefully packages all LiNi₀.₈Co₀.₁₅Al₀.₀₅O₂ sputtering targets in cleanroom-safe materials, vacuum-sealed or argon-filled, with outer protective casing to prevent physical or chemical damage. Each unit is labeled with material composition, batch number, and purity for traceability.

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TFM offers NCA sputtering targets (LiNi₀.₈Co₀.₁₅Al₀.₀₅O₂) in custom sizes, purities, and bonding configurations tailored to your research or production needs. These targets are ideal for applications in solid-state batteries, thin-film cathode engineering, and electrochemical material studies.
Contact us to request pricing or discuss custom sputtering target options.

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LiNi₀.₈Co₀.₁₅Al₀.₀₅O₂ ø101.6 × 3mm Indium Bonded 2.54mm Cu B/Plate w/ Keeper

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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