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ST0194A Tin(II) Oxide (SnO) Sputtering Target

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Tin Monoxide (SnO) Sputtering Target Description

Tin Monoxide (SnO) sputtering targets offered by TFM are high-performance oxide ceramic materials composed of tin (Sn) and oxygen (O) in a 1:1 atomic ratio. These targets are specifically engineered for use in thin film deposition techniques, particularly in applications requiring p-type semiconducting properties.

Tin, also known by its Latin name “stannum,” is a metallic element with a rich history dating back to ancient civilizations around 3500 BC. The symbol “Sn” originates from its Latin root. Tin has an atomic number of 50, is found in Period 5, Group 14 of the periodic table, and is classified under the p-block. It has a relative atomic mass of 118.710(7) Dalton.

Related Product: Tin Sputtering Target

Oxygen, a vital element for life and numerous chemical processes, carries the symbol “O” and was discovered in the 18th century by Carl Wilhelm Scheele. It is positioned in Period 2, Group 16 of the periodic table and is part of the p-block. Its atomic number is 8, and the relative atomic mass is 15.9994(3) Dalton.

Tin Monoxide Sputtering Target Specification

PropertyValue
Compound FormulaSnO
Molecular Weight134.71 g/mol
AppearanceBlack or bluish-black solid
Melting Point~1080 °C
Density~6.45 g/cm³
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Tin Monoxide Sputtering Target Handling Notes

  1. Elastomer bonding is recommended for SnO sputtering targets due to their ceramic nature and susceptibility to cracking or delamination under direct thermal stress.

  2. SnO exhibits moderate thermal instability and can oxidize to SnO₂ or reduce to Sn metal under certain conditions; proper process control is essential during deposition.

Tin Monoxide Sputtering Target Packaging

TFM ensures all tin monoxide sputtering targets are carefully labeled and securely packaged to prevent any contamination or mechanical damage during transit. Our packaging protocols are designed to preserve product integrity and facilitate safe handling upon delivery.

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TFM supplies SnO sputtering targets in various dimensions, purities, and configurations tailored for CVD, PVD, and other vacuum deposition systems. Our materials are developed with tight control over purity, grain structure, and mechanical properties, making them suitable for research and industrial-scale thin film production.
Contact Us today for a quote or additional information on availability and custom compositions.

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SnO Target 99.95% ø50.8*3.18mm Indium Bonded 3mm Cu B/Plate, SnO Target 99.95% ø50.8*6.35mm Indium Bonded 3mm Cu B/Plate, SnO Target 99.9% ø50.8*6mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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