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ST0917 Stainless Steel Sputtering Target

Chemical FormulaFe/Cr/Ni
Catalog No.ST0917
CAS Number65997-19-5
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Stainless Steel sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Stainless Steel Sputtering Targets are versatile alloy targets widely used in magnetron sputtering systems to deposit corrosion-resistant, mechanically durable, and conductive thin films. Combining iron with chromium, nickel, and other alloying elements, stainless steel provides an excellent balance of chemical stability, structural strength, and cost efficiency.

Stainless steel thin films are commonly applied in decorative coatings, functional layers, barrier films, and industrial protective applications. With stable sputtering behavior and customizable compositions, these targets support both research-scale and large-scale industrial deposition processes.

Detailed Description

Stainless Steel Sputtering Targets are manufactured from vacuum-melted or remelted stainless steel alloys to ensure homogeneous composition and reduced inclusions. Common grades include:

  • 304 Stainless Steel

  • 316 / 316L Stainless Steel

  • 430 Stainless Steel

  • Custom alloy compositions upon request

The chromium content (typically ≥10.5%) provides corrosion resistance through passive oxide formation, while nickel enhances ductility and toughness. Molybdenum additions (e.g., in 316L) improve resistance to pitting corrosion.

Key manufacturing features include:

  • High density to minimize particle generation

  • Uniform microstructure for consistent sputtering rates

  • Optional copper backing plate bonding for thermal management

  • Precision machining to match cathode requirements

Stainless steel targets are compatible with DC magnetron sputtering due to their electrical conductivity. RF sputtering can also be used when required by specific system configurations.

Deposited films can exhibit:

  • Strong adhesion to substrates

  • Corrosion and wear resistance

  • Moderate electrical conductivity

  • Uniform metallic appearance

Applications

Stainless Steel Sputtering Targets are widely used in:

  • Decorative metallic coatings

  • Protective corrosion-resistant films

  • Barrier layers in microelectronics

  • Architectural and hardware coatings

  • Automotive trim coatings

  • Wear-resistant industrial components

  • Thin film research and prototyping

In decorative and industrial coatings, stainless steel films offer a durable metallic finish with enhanced chemical resistance.

Technical Parameters

ParameterTypical Value / RangeImportance
Alloy Grade304 / 316 / 316L / 430 (custom)Determines corrosion & mechanical properties
PurityIndustrial grade or customizedEnsures consistent film composition
Diameter25 – 300 mm (custom)Matches sputtering system holders
Thickness3 – 8 mmInfluences target lifetime
Density≥ 99% theoreticalReduces particle generation
BondingCopper backing plate (optional)Improves heat transfer & stability

Segmented and rotary targets are available for large-area coating systems.

Comparison with Related Metallic Targets

MaterialKey AdvantageTypical Application
Stainless SteelCorrosion resistance & cost efficiencyProtective & decorative coatings
Pure Iron (Fe)High magnetic responseMagnetic films
Nickel (Ni)Good corrosion resistanceFunctional metallic layers
Chromium (Cr)Hardness & adhesionHard coatings

Compared to pure metals, stainless steel provides a balanced combination of corrosion resistance and mechanical durability in a single alloy system.

FAQ

QuestionAnswer
Can specific stainless steel grades be supplied?Yes, common grades such as 304 and 316L are available, along with custom alloys.
Is copper backing recommended?For high-power or continuous sputtering, bonded targets are recommended for better heat management.
Are rotary targets available?Yes, both planar and rotary configurations can be manufactured.
What sputtering method is suitable?DC magnetron sputtering is typically used due to its conductivity.
How are the targets packaged?Vacuum-sealed and securely packed in export-grade cartons or wooden crates.

Packaging

Our Stainless Steel Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

Stainless Steel Sputtering Targets provide a reliable and cost-effective solution for corrosion-resistant and decorative thin film applications. With customizable alloy grades, high-density manufacturing, and optional backing plate bonding, they deliver stable sputtering performance and consistent film quality.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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