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ST0917 Stainless Steel Sputtering Target

Chemical FormulaFe/Cr/Ni
Catalog No.ST0917
CAS Number65997-19-5
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Stainless Steel sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Stainless Steel Sputtering Target Description

Stainless Steel Sputtering Target is a specialized material utilized in the sputter deposition process, which is essential for producing thin films used in various applications across electronics, optics, and coatings industries.

Stainless steel, an alloy primarily composed of iron, chromium, nickel, and other elements, is employed in sputtering targets due to its high purity and suitability for thin-film deposition. The exact composition of the stainless steel can vary based on the grade and specific use case.

During sputtering, the stainless steel target is bombarded with high-energy ions within a vacuum chamber. This bombardment dislodges atoms or particles from the target material, which then deposit onto a substrate to form a thin film that mirrors the composition of the target.

Related Product: Chromium Sputtering Target

Stainless Steel Sputtering Target Specifications

Compound FormulaFe/Cr/Ni
Molecular Weight–
AppearanceMetallic Target
Melting Point–
Density–
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Stainless Steel Sputtering Target Handling Notes

Indium bonding is recommended for Stainless Steel Sputtering Targets due to their inherent characteristics, such as brittleness and low thermal conductivity. These properties can make the target more susceptible to thermal shock during sputtering. Indium bonding helps address these issues by providing a more stable and reliable attachment of the target to the sputtering system, ensuring better performance and longevity.

Stainless Steel Sputtering Target Application

The use of a Stainless Steel Sputtering Target enables precise control over the deposition process, facilitating the creation of thin films with specific properties tailored to the requirements of various applications. This level of control is crucial for achieving desired characteristics in industries such as electronics, optics, and coatings.

Stainless Steel Sputtering Target Packaging

Our Stainless Steel Sputtering Targets are meticulously handled during storage and transportation to ensure they retain their quality and integrity in their original condition.

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TFM offers Stainless Steel Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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