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ST0047B Strontium Bismuth Niobate Sputtering Targets (SBN (SrBi2Nb2O9))

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Strontium Bismuth Niobate Sputtering Targets

TFM offers Strontium Bismuth Niobate (SrBi₂Nb₂O₉) Sputtering Targets, designed for high-performance thin-film deposition. These targets are renowned for their ferroelectric and piezoelectric properties, which make them ideal for applications in advanced electronic devices, memory devices, and sensor technologies. Strontium Bismuth Niobate is widely used in non-volatile memory, electronic ceramics, and optoelectronic applications due to its excellent performance in thin-film form.

Key Features and Advantages

  • High Purity – TFM’s Strontium Bismuth Niobate sputtering targets come in 99.9% purity, ensuring the deposition of thin films with consistent quality and high performance.

  • Ferroelectric and Piezoelectric Properties – The material exhibits both ferroelectric and piezoelectric behavior, making it ideal for non-volatile memory, multilayer capacitors, and electronic sensors.

  • Thin Film Deposition – Strontium Bismuth Niobate sputtering targets provide uniform thin films suitable for advanced electronic devices, energy harvesting, and multilayer thin-film technologies.

  • Customizable Sizes – Available in various sizes to meet both research and production needs, from small-scale experimental setups to large-scale manufacturing.

  • Durability and Stability – Produced using cold pressing and sintering techniques, these targets offer excellent stability during deposition, ensuring high-density films and consistent performance.

Specifications

  • Purity: 99.9%

  • Target Types Available:

    • Circular Targets: Diameter ≤ 14 inches, Thickness ≥ 1mm

    • Block Targets: Length ≤ 32 inches, Width ≤ 12 inches, Thickness ≥ 1mm

Applications

  • Ferroelectric Memories – Strontium Bismuth Niobate is widely used in non-volatile memory devices due to its ferroelectric properties. It is ideal for high-density storage applications and random access memory (RAM) technologies.

  • Piezoelectric Devices – These targets are key materials in the development of sensors, actuators, and energy harvesting devices used in industries such as automotive, medical, and consumer electronics.

  • Optoelectronic Devices – Strontium Bismuth Niobate films are used in optical devices, including lasers, optical sensors, and thin-film mirrors.

  • Capacitors – Used in the production of multilayer ceramic capacitors (MLCCs) for high-performance electronic and telecommunication devices.

Manufacturing Process

  • Cold Pressing & Sintering – These techniques ensure the targets have the appropriate high density and optimal performance for thin-film deposition.

  • Elastomer Bonding – Targets are bonded to a backing plate to improve film deposition uniformity and handling.

  • Cleaning & Packaging – Each target is cleaned and packaged in an environmentally controlled setting to prevent contamination and ensure they are ready for vacuum deposition processes.

Options

  • Custom Sizes – Available in custom sizes to meet specific application requirements, providing flexibility in research and large-scale production.

  • Research and Development – Smaller sizes are available for R&D, enabling innovation and experimental testing.

  • Sputtering Target Bonding Service – TFM offers target bonding services to enhance target performance and sputtering efficiency, improving thin-film quality.

Industry Impact

Strontium Bismuth Niobate Sputtering Targets are indispensable in industries that require high-quality ferroelectric and piezoelectric materials. With applications in non-volatile memory, electronic sensors, energy storage devices, and optoelectronic technologies, these targets contribute to the advancement of next-generation electronics and sensor systems. TFM’s commitment to high purity, customizable sizes, and robust manufacturing processes ensures that our Strontium Bismuth Niobate sputtering targets meet the demands of high-performance applications in diverse sectors.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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