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Strontium Cobalt Oxide Sputtering Target

ST0990 Strontium Cobalt Oxide Sputtering Target, SrCoO3

Chemical FormulaSrCoO3
Catalog No.ST0990
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

TFM provides Strontium Cobalt Oxide Sputtering Targets that combine high quality with competitive pricing. Our extensive expertise ensures that you receive sputtering targets of exceptional purity and available in various sizes. We are committed to supplying top-grade materials that meet your research and production needs.

MSDS File

Strontium Cobalt Oxide Sputtering Target Description

Strontium Cobalt Oxide Sputtering Targets are distinguished by their high purity, density, sputtering rate, and low resistivity. These targets offer excellent chemical stability and resistance to high-temperature oxidation, making them suitable for use in elevated temperature and vacuum environments. Their superior physical and electrical characteristics make them valuable in a range of applications across electronics, communications, energy, and environmental protection sectors.

To achieve optimal quality, the production of Strontium Cobalt Oxide Sputtering Targets requires stringent control over the purity of raw materials, process parameters, and sintering conditions. This meticulous approach ensures that the targets deliver exceptional performance and reliability in various high-tech applications.

Related Product: Strontium Sputtering Target, Strontium Oxide Sputtering Target

Strontium Cobalt Oxide Sputtering Target Specifications

Compound FormulaSrCoO3
AppearanceDark Gray Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Strontium Cobalt Oxide Sputtering Target Handling Notes

Indium bonding is advised for Strontium Cobalt Oxide Sputtering Targets due to the material’s inherent properties that can complicate sputtering processes. Strontium Cobalt Oxide is characterized by its brittleness and low thermal conductivity, which can lead to issues such as thermal shock during sputtering. By using Indium bonding, these challenges are mitigated, providing a more stable and reliable attachment for the sputtering target. This bonding method helps maintain target integrity and performance, ensuring consistent sputtering results and extending the lifespan of the target.

Strontium Cobalt Oxide Sputtering Target Application

Strontium Cobalt Oxide Sputtering Targets are versatile materials with applications across various industries:

  1. Electronics and Information Technology: In fields like integrated circuits, data storage, liquid crystal displays (LCDs), laser memory, and electronic control devices, Strontium Cobalt Oxide Sputtering Targets are used to create diverse thin film materials. For instance, in integrated circuits, these targets help produce electrical interconnection films and barrier layers, crucial for device functionality and performance.
  2. Flat Panel Display Industry: Strontium Cobalt Oxide Sputtering Targets play a key role in manufacturing various types of flat panel displays, including LCDs, plasma displays (PDPs), field-emission displays (FEDs), and electroluminescent displays (ELDs). They are used to deposit functional films such as dielectric layers, conductive films, and barrier films, which are essential for the display’s quality and durability.
  3. Wear-Resistant and High-Temperature Corrosion-Resistant Applications: Due to their excellent physical and chemical properties, Strontium Cobalt Oxide Sputtering Targets are utilized in creating wear-resistant and high-temperature corrosion-resistant materials. They are used in the production of engine parts, thermal energy equipment, and other high-demand environments where durability is critical.
  4. Optical Field: In optical applications, these sputtering targets are employed to prepare various optical films, including those that enhance transmittance, provide reflectivity, and act as filters. These films are widely used in optical instruments, photographic equipment, lighting fixtures, and other optical technologies.
  5. Solar Cell Production: Strontium Cobalt Oxide Sputtering Targets are integral to the manufacture of solar cell components, such as electrodes and mirrors. By using these targets to sputter SrCoO3 films, the efficiency of light absorption and photoelectric conversion in solar cells can be significantly improved, contributing to more effective solar energy utilization.

Strontium Cobalt Oxide Sputtering Target Packaging

Our Strontium Cobalt Oxide Sputtering Target is meticulously managed throughout storage and transportation to maintain its high quality and ensure it arrives in pristine condition.

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TFM offers Strontium Cobalt Oxide Sputtering Targets in a range of forms, purities, and sizes. We are dedicated to producing high-purity physical vapor deposition (PVD) materials, ensuring the highest density and smallest average grain sizes. These targets are ideal for applications in semiconductor manufacturing, chemical vapor deposition (CVD), and various PVD processes for display and optical technologies.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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