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ST0471 Strontium Niobium Titanate Sputtering Target

Chemical Formula: SrNb(1-x)TixO3
Catalog Number: ST0471
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Strontium Niobium Titanate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

The Strontium Niobium Titanate Sputtering Target is a complex oxide ceramic target widely used for depositing functional thin films with advanced electrical and dielectric properties. As a member of the perovskite oxide family, strontium niobium titanate exhibits excellent electrical conductivity, dielectric stability, and tunable electronic behavior, making it valuable for oxide electronics, thin film capacitors, sensors, and advanced semiconductor research.

Through magnetron sputtering or other physical vapor deposition (PVD) techniques, strontium niobium titanate targets allow the formation of high-quality oxide thin films with controlled composition and microstructure. These materials are particularly important in the development of functional oxide devices and emerging electronic materials.

Detailed Description

Strontium Niobium Titanate sputtering targets are typically manufactured from high-purity precursor oxides including strontium oxide (or carbonate), niobium oxide, and titanium oxide. These powders are carefully mixed, calcined, and sintered through advanced ceramic processing techniques such as hot pressing, vacuum sintering, or hot isostatic pressing (HIP) to achieve high density and homogeneous composition.

The resulting material typically adopts a perovskite-type crystal structure, which is well known for its versatile electronic and dielectric properties. By adjusting the relative proportions of niobium and titanium within the lattice, researchers can tailor the electrical conductivity, dielectric constant, and carrier concentration of the material.

Niobium acts as a donor dopant that can increase electrical conductivity, while titanium contributes to the structural stability and dielectric behavior of the compound. This combination enables thin films with tunable electronic properties, making them suitable for a variety of electronic and electrochemical applications.

High-density sputtering targets ensure stable plasma conditions during deposition and minimize particle generation, which is essential for producing uniform thin films. For high-power sputtering systems, strontium niobium titanate targets can also be supplied as bonded targets with copper backing plates, typically using indium bonding to improve heat dissipation and mechanical stability.

Applications

Strontium Niobium Titanate sputtering targets are used in a range of advanced technology areas:

  • Oxide electronic devices requiring functional perovskite thin films

  • Thin film capacitors and dielectric layers in microelectronics

  • Sensors and electrochemical devices utilizing conductive oxide films

  • Transparent conductive oxide research in advanced materials development

  • Ferroelectric and dielectric thin film studies

  • Academic and industrial research laboratories studying perovskite oxides

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionSr–Nb–Ti–O complex oxideDetermines electrical and dielectric behavior
Purity≥ 99.9%Ensures stable thin film properties
Diameter25 – 300 mm (custom)Compatible with common sputtering systems
Thickness3 – 6 mmInfluences sputtering stability and target lifetime
Density≥ 95% theoretical densitySupports uniform film deposition
BondingCopper backing plate / Indium bondedImproves heat transfer and target durability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Strontium Niobium TitanateTunable conductivity and dielectric propertiesFunctional oxide electronics
Strontium Titanate (SrTiO₃)High dielectric constant and good lattice compatibilitySubstrates and dielectric films
Niobium Oxide (Nb₂O₅)High dielectric constantCapacitors and optical coatings

FAQ

QuestionAnswer
What sputtering methods are suitable for this target?Strontium Niobium Titanate sputtering targets are typically used in RF magnetron sputtering systems suitable for ceramic materials.
Can the target composition be customized?Yes. The ratio of strontium, niobium, and titanium can be adjusted depending on the desired electronic properties.
Are bonded sputtering targets available?Yes. Targets can be bonded to copper backing plates to improve heat dissipation during sputtering.
What substrates can these films be deposited on?Films can be deposited on silicon wafers, glass, ceramic substrates, and other oxide materials.
What purity levels are typically available?Standard purities typically range from 99.9% and above for advanced electronic applications.

Packaging

Our Strontium Niobium Titanate Sputtering Target products are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. Each target is carefully packaged in vacuum-sealed bags with protective foam and export-grade cartons or wooden crates to prevent contamination and mechanical damage during storage and transportation.

Conclusion

The Strontium Niobium Titanate Sputtering Target provides a reliable solution for depositing functional oxide thin films used in advanced electronic and electrochemical devices. Its perovskite structure and tunable electrical properties make it an important material for oxide electronics, dielectric devices, and materials research.

With customizable compositions, high-density ceramic manufacturing, and stable sputtering performance, strontium niobium titanate sputtering targets support both industrial thin film production and cutting-edge research in functional oxide materials.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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