Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
strontium-titanate-sputtering-target-srtio3-removebg-preview-1

ST0189 Strontium Titanate Sputtering Target, SrTiO3

Chemical Formula: SrTiO3
Catalog Number: ST0189
CAS Number: 12060-59-2
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Strontium Titanate  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Strontium Titanate Sputtering Target Description

Strontium Titanate (SrTiO₃) sputtering target from TFM is an oxide sputtering material composed of strontium (Sr), titanium (Ti), and oxygen (O). Strontium titanate is widely used in thin film deposition processes due to its dielectric properties, making it an essential material in the production of capacitors, sensors, and other electronic devices. It is also utilized in optoelectronic applications and has been studied for its potential use in quantum computing and other advanced technological fields. The material is known for its perovskite crystal structure, which contributes to its excellent thermal and electrical properties.

StrontiumStrontium is a chemical element named after the small town of Strontian in Scotland. It was first identified in 1787 by William Cruikshank, and later isolated and formally recognized as an element by Humphry Davy. The chemical symbol for strontium is “Sr,” and it is placed in Group 2 and Period 5 of the periodic table, belonging to the s-block. Strontium has an atomic number of 38 and a relative atomic mass of 87.62(1) Dalton, with the number in brackets indicating the uncertainty in its measurement. Strontium is known for its use in fireworks, where it imparts a bright red color, and in producing ferrite magnets and refining zinc.

Related Product: Strontium Sputtering Target

TitaniumTitanium is a chemical element named after the Titans of Greek mythology, symbolizing strength and endurance. It was first identified in 1791 by William Gregor, and its isolation was later achieved and announced by Jöns Jakob Berzelius. The chemical symbol for titanium is “Ti.” It is located in Group 4 and Period 4 of the periodic table, within the d-block. Titanium has an atomic number of 22 and a relative atomic mass of 47.867(1) Dalton, with the number in brackets indicating the measurement uncertainty. Titanium is well known for its high strength-to-weight ratio, corrosion resistance, and applications in aerospace, medical implants, and as a pigment in paints and coatings.

Related Product: Titanium Sputtering Target

OxygenOxygen is a chemical element that originated from the Greek ‘oxy’ and ‘genes’ meaning acid-forming. It was first mentioned in 1771 and observed by W. Scheele. The isolation was later accomplished and announced by W. Scheele. “O” is the canonical chemical symbol of oxygen. Its atomic number in the periodic table of elements is 8 with a location at Period 2 and Group 16, belonging to the p-block. The relative atomic mass of oxygen is 15.9994(3) Dalton, the number in the brackets indicating the uncertainty.

Elastomer Bonding

Strontium Titanate Sputtering Target Handling Notes

  • Elastomer Bonding: It is recommended for strontium titanate (SrTiO3) sputtering material due to its brittleness and low thermal conductivity, which can make it challenging to use in sputtering processes.
  • Thermal Properties: SrTiO3 has a low thermal conductivity, making it susceptible to thermal shock. This characteristic requires careful handling and specific bonding techniques, like elastomer bonding, to ensure the integrity and longevity of the material during use.

Strontium Titanate Sputtering Target Packaging

Our strontium titanate sputtering target is clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care in handling and packaging to prevent any damage that might occur during storage or transportation, ensuring the product arrives in pristine condition.

Get Contact

TFM offers Strontium Titanate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0189 Strontium Titanate Sputtering Target, SrTiO3”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top