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Lithium Oxide Sputtering Targets

ST0880 Tantalum doped Lithium Lanthanum Zirconate Sputtering Target

Chemical Formula: Ta-doped LLZO
Catalog Number: ST0880
Purity: 99.9% ~ 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tantalum-Doped Lithium Lanthanum Zirconate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Tantalum doped Lithium Lanthanum Zirconate Sputtering Target Description

TantalumTantalum-doped lithium lanthanum zirconate sputtering target is a white sputtering material containing Ta, Li, La, Zr, and O. It serves as a conductive ceramic solid electrolyte material for lithium-ion batteries.

Tantalum is a rare, hard, blue-gray, lustrous transition metal known for its high corrosion resistance. As part of the refractory metals group, it is used as a minor component in alloys. Its chemical inertness makes it valuable in laboratory equipment and as a substitute for platinum.

Related: Tantalum Sputtering Target.

Lithium

Lithium is a chemical element derived from the Greek word ‘lithos,’ meaning stone. First identified in 1817 by A. Arfwedson, its isolation was achieved by W. T. Brande. Represented by the symbol “Li,” lithium has an atomic number of 3, is located in Period 2 and Group 1 of the periodic table, and belongs to the s-block. Its relative atomic mass is 6.941(2) Dalton, with the number in brackets indicating the uncertainty.

Related: Lithium Sputtering Target

LanthanumLanthanum, symbolized as La and with an atomic number of 57, is a soft, malleable, silvery-white metal. It is one of the most reactive rare earth elements. Lanthanum is used in the production of specialized optical glasses and to enhance the malleability of steel. Additionally, it plays a role in wastewater treatment and oil refining. Due to its use in photoconversion films, lanthanum is sometimes referred to as “super calcium.”

Related: Lanthanum Sputtering Target

ZirconiumZirconium is a lustrous, grey-white transition metal known for its strength and resemblance to hafnium and, to a lesser degree, titanium. It is primarily used as a refractory and opacifier, with smaller quantities employed as an alloying agent due to its excellent corrosion resistance. Zirconium forms several inorganic and organometallic compounds, including zirconium dioxide and zirconocene dichloride. It has five naturally occurring isotopes, three of which are stable. Zirconium compounds do not have any known biological roles.

Related: Zirconium Sputtering Target

Tantalum doped Lithium Lanthanum Zirconate Sputtering Target Specification

Material TypeTantalum doped Lithium Lanthanum Zirconate Sputtering Target
SymbolTa-doped LLZO
Color/AppearanceWhite Solid
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Tantalum doped Lithium Lanthanum Zirconate Sputtering Target Packing

Our Tantalum-Doped Lithium Lanthanum Zirconate Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage or transportation.

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Tantalum-Doped Lithium Lanthanum Zirconate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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