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VD0581 Tantalum Evaporation Materials, Ta

Material Type：Tantalum
Symbol：Ta
Color/Appearance：Gray Blue, Metallic
Purity：99.9% ~ 99.95%
Shape：Powder / Granule / Custom-made

TFM is a leading manufacturer and supplier of high-purity tantalum evaporation materials, along with a wide range of other evaporation materials. We provide these materials in both powder and granule forms, with customized options available upon request.

MSDS File

Tantalum Evaporation Materials Description

Tantalum is a heavy, ductile, and hard metal with a melting point of 3,017°C, a density of 16.6 g/cc, and a vapor pressure of 10^-4 Torr at 2,590°C. Its dark blue-gray appearance and high corrosion resistance make it ideal for various applications. Tantalum is particularly resistant to chemical attack at temperatures below 150°C and can only be dissolved with hydrofluoric acid. Due to its non-toxic properties, it is commonly used in surgical implants and as a capacitor in electronics. It can also be alloyed with other metals to enhance strength and durability.

High-purity tantalum evaporation materials are essential for achieving high-quality deposited films in various processes. TFM specializes in producing tantalum evaporation materials with purity levels up to 99.95%, employing stringent quality assurance processes to ensure product reliability.

tantalum evaporation materials

Tantalum Evaporation Materials Specification

Material TypeTantalum
SymbolTa
Color/AppearanceGray Blue, Metallic
Thermal Conductivity57 W/m.K
Melting Point3,017°C
Coefficient of Thermal Expansion6.3 x 10-6/K
SynonymsTantalum pellets, Tantalum Pieces, Tantalum Evaporation Pellet, Ta Pellets, Ta Pieces, Ta Evaporation Pellet

Tantalum Evaporation Materials Application

  • Deposition Processes: Tantalum evaporation materials are utilized in semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: They are also employed in optics for applications such as wear protection, decorative coatings, and display technologies.

Tantalum Evaporation Materials Packaging

We carefully handle our tantalum evaporation materials to avoid damage during storage and transportation, ensuring that their quality is preserved in their original condition.

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TFM offers tantalum evaporation materials in a variety of forms, purities, sizes, and prices. We focus on producing high-purity e-beam evaporation materials, emphasizing the highest possible density and the smallest average grain sizes. For current pricing on evaporation pellets and other deposition materials not listed, please contact us for more details.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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