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VD0647 Tantalum Molybdenum Evaporation Materials, Ta/Mo

Catalog No.VD0647
MaterialTantalum Molybdenum (Ta/Mo)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM is a prominent manufacturer and supplier of high-purity tantalum-molybdenum evaporation materials, alongside a broad range of other evaporation materials. Our offerings include materials in both powder and granule forms, with customized options available upon request to meet specific needs.

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Tantalum Molybdenum Evaporation Materials Overview

TFM offers high-purity tantalum-molybdenum evaporation materials, an alloy of tantalum (Ta) and molybdenum (Mo). These materials are essential for achieving high-quality films during deposition processes. Our tantalum-molybdenum materials reach an impressive purity of up to 99.9995%, thanks to our stringent quality control measures that ensure reliability and performance.

Related Products: Tantalum Evaporation Materials, Molybdenum Evaporation Materials

Applications of Tantalum Molybdenum Evaporation Materials

Our tantalum-molybdenum evaporation materials are utilized in a variety of advanced applications:

  • Deposition Processes: Vital for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Coatings: Suitable for wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

Each batch of tantalum-molybdenum evaporation materials is carefully tagged and labeled for easy identification and quality assurance. We ensure that these materials are handled with the utmost care to prevent damage during storage and transport.

Contact Us

TFM is a leading provider of high-purity tantalum-molybdenum evaporation materials. We offer these materials in various forms including tablets, granules, rods, and wires, with custom shapes and quantities available upon request. Additionally, we supply related products such as evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or to inquire about materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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