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tantalum-silicide

VD0806 Tantalum Silicide Evaporation Materials, TaSi2

Catalog No.VD0806
MaterialTantalum Silicide (TaSi2)
Purity99.5%
ShapePowder/ Granule/ Custom-made
TFM stands out as a top manufacturer and supplier of high-purity tantalum silicide evaporation materials. We offer an extensive range of evaporation materials, available in both powder and granule forms. Additionally, we provide customization options to meet specific needs upon request.
MSDS File

Tantalum Silicide Evaporation Materials: Overview

Tantalum silicide evaporation materials, with the chemical formula TaSi₂, are specialized silicide ceramics known for their exceptional purity. TFM excels in manufacturing tantalum silicide materials with purity levels reaching up to 99.9995%. These high-purity materials are crucial in deposition processes, ensuring the production of high-quality deposited films. Our rigorous quality assurance procedures guarantee the reliability of these materials for various applications.

Applications of Tantalum Silicide Evaporation Materials

Our tantalum silicide evaporation materials are utilized across several deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are particularly valuable for optics applications such as wear protection, decorative coatings, and display technologies.

Packaging and Handling

TFM ensures that tantalum silicide evaporation materials are meticulously tagged and labeled to facilitate easy identification and stringent quality control. We prioritize the safe packaging and handling of these materials to prevent any damage during storage and transportation.

Contact Us

As a leading supplier of high-purity tantalum silicide evaporation materials, TFM offers a range of forms including tablets, granules, rods, and wires. We also provide custom shapes and quantities upon request. In addition to tantalum silicide, we offer evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and to inquire about products not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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