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ST0930 Tellurium Dioxide Sputtering Target, TeO2

Chemical FormulaTeO2
Catalog No.ST0930
CAS Number7446-7-3
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Tellurium Dioxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Tellurium Dioxide Sputtering Target

Introduction

Tellurium Dioxide Sputtering Target (TeO₂) is a high-purity oxide material primarily used for optical coatings, acousto-optic devices, and semiconductor applications. Owing to its excellent transparency in the visible and infrared range, high refractive index, and stable sputtering behavior, TeO₂ has become an important material for producing advanced optical films and functional thin layers in photonic and microelectronic systems.

Detailed Description

Tellurium Dioxide is a crystalline oxide of tellurium, typically existing in the tetragonal phase with strong birefringence and acousto-optic properties. When used as a sputtering target, TeO₂ produces films that exhibit high optical clarity, low absorption, and good environmental durability.

Our TeO₂ targets are manufactured from high-purity tellurium oxide powder (up to 99.99%) and processed by vacuum sintering or hot pressing, ensuring uniform density, fine microstructure, and minimal contamination.

Key characteristics include:

  • High optical quality: Produces clear, low-defect films with precise refractive control.

  • Excellent thermal and chemical stability: Maintains structure during sputtering at elevated temperatures.

  • Good mechanical strength: Reduces cracking and particle release under magnetron sputtering.

  • High density and purity: Ensures consistent film thickness and composition control.

  • Custom configurations: Available as planar or step targets, with optional copper or titanium backing plates for improved heat dissipation.

Applications

Tellurium Dioxide Sputtering Targets are widely used in:

  • Acousto-optic devices: Such as modulators, deflectors, and tunable filters.

  • Optical coatings: High-refractive-index layers in infrared and visible optical systems.

  • Semiconductor thin films: Used in dielectric and sensor coatings.

  • Photonic devices: Optical waveguides and polarization control films.

  • Research and development: Thin film studies in material science and optical engineering.

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaTeO₂Defines the stoichiometric oxide composition
Purity99.9% – 99.99%High purity ensures optical clarity and stable sputtering
Density5.99 g/cm³Affects film deposition rate and uniformity
Melting Point733 °CDetermines suitable sputtering temperature
FormPlanar / Step / RotaryFits various sputtering systems
Diameter25 – 300 mm (custom)Matches different target holders
Thickness3 – 6 mmInfluences sputtering time and rate
Backing PlateCopper / TitaniumImproves heat dissipation and bonding stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Tellurium Dioxide (TeO₂)High refractive index, acousto-optic propertiesOptical and photonic coatings
Silicon Dioxide (SiO₂)High transparency, low refractive indexDielectric and optical coatings
Zinc Oxide (ZnO)Conductive and transparentSemiconductor and display coatings

FAQ

QuestionAnswer
Can TeO₂ targets be customized?Yes. We can supply customized diameters, thicknesses, and bonded backing plates.
Which sputtering systems are compatible?Suitable for DC, RF, and magnetron sputtering systems.
What purity levels are available?Standard purities are 99.9% and 99.99%, with higher grades available upon request.
What are the typical film properties?TeO₂ films exhibit high refractive index (~2.3 at 632 nm) and excellent optical transmission.
Is it moisture sensitive?Moderately; targets are vacuum-sealed to prevent surface degradation.
How is the product packaged?Vacuum-sealed with anti-static protection, cushioned in export-safe wooden or carton crates.
What industries commonly use it?Optics, photonics, semiconductor manufacturing, and R&D.

Packaging

Each Tellurium Dioxide Sputtering Target is vacuum-sealed and moisture-protected to prevent oxidation and contamination. Packaging includes foam cushioning and anti-static materials, ensuring safe international transport. Labels include purity, dimensions, lot number, and manufacturing batch for full traceability.

Conclusion

Tellurium Dioxide Sputtering Targets provide exceptional optical and acousto-optic performance, making them essential for high-precision coating and photonic applications. Their purity, stability, and customizable specifications enable consistent results in both research and industrial thin-film production.

For detailed specifications or to request a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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