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ST0930 Tellurium Dioxide Sputtering Target, TeO2

Chemical FormulaTeO2
Catalog No.ST0930
CAS Number7446-7-3
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Tellurium Dioxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Tellurium Dioxide Sputtering Target Description

The Tellurium Dioxide Sputtering Target is a material utilized in the sputtering technique to deposit thin films onto various substrates. This compound, made up of tellurium (Te) and oxygen (O), serves as the target in this process.

During sputtering, a high-energy ion beam is aimed at the Tellurium Dioxide Sputtering Target. This bombardment results in the ejection of atoms or molecules from the target’s surface. These ejected particles then travel to a substrate, where they form a thin film that retains the properties of the tellurium dioxide. This process is vital for creating thin films with specific characteristics for use in a range of applications, including electronics and coatings.

Tellurium Dioxide Sputtering Target Specifications

Compound FormulaTeO2
Molecular Weight209.94
AppearanceWhite target
Melting Point (℃)950-1012
Density (g/cm3)5.9
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Tellurium Dioxide Sputtering Target Handling Notes

Indium bonding is suggested for Tellurium Dioxide Sputtering Targets due to the material’s inherent properties that can pose challenges during sputtering. Tellurium dioxide exhibits brittleness and low thermal conductivity, making it prone to thermal shock. These characteristics can complicate the sputtering process, so indium bonding is used to improve performance and ensure stable operation.

Tellurium Dioxide Sputtering Target Application

Tellurium dioxide thin films offer a range of applications across various industries:

  • Optical Coatings: These films are used in optical coatings for applications like anti-reflective coatings, beam splitters, and other optical components. Their unique properties make them suitable for enhancing the performance of optical devices.
  • Semiconductor Manufacturing: In the semiconductor industry, tellurium dioxide coatings are applied in the fabrication of electronic and optoelectronic devices. Their specific characteristics contribute to the functionality and efficiency of these components.
  • Photovoltaics: Tellurium dioxide is utilized in the production of thin-film solar cells. Its properties are leveraged in the manufacturing process to improve the performance and durability of solar technology.
  • Research and Development: In research and development, tellurium dioxide thin films are employed for specialized applications where their distinct properties are advantageous. This includes exploring new technologies and materials where tellurium dioxide can provide unique benefits.

Tellurium Dioxide Sputtering Target Packaging

Our Tellurium Dioxide Sputtering Target is extensively utilized in the creation of coatings for diverse applications. These coatings can improve tool wear resistance, enhance surface durability, and impart specific optical or electrical properties. Whether for industrial tools, protective surfaces, or specialized optical and electronic applications, our Tellurium Dioxide Sputtering Target delivers reliable performance and tailored results.

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TFM offers Tellurium Dioxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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