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Tellurium Evaporation Materials

VD0582 Tellurium Evaporation Materials, Te

Catalog No.VD0582
MaterialTellurium (Te)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM is a leading manufacturer and supplier of high-purity tellurium evaporation materials, along with a diverse range of other evaporation materials. We provide these materials in both powder and granule forms, and we also offer customized options upon request.

MSDS File

Introduction

Tellurium Evaporation Materials play a critical role in thin film deposition for optoelectronics, photovoltaics, infrared optics, and advanced semiconductor research. As a key chalcogen element, tellurium is widely used to tailor electrical, optical, and thermoelectric properties in functional coatings and compound semiconductor films. High-purity tellurium evaporation materials ensure stable evaporation behavior, precise composition control, and high-quality thin film performance.

Detailed Description

Tellurium evaporation materials are supplied in carefully controlled physical forms—such as pellets, granules, shots, or pieces—optimized for thermal evaporation, electron-beam (e-beam) evaporation, and related PVD processes. High material purity is essential, as trace impurities can significantly affect film conductivity, carrier concentration, and optical absorption.

Our tellurium evaporation materials are refined and processed to achieve uniform composition, low oxygen and metallic impurity levels, and predictable evaporation rates. The material’s relatively low melting point enables efficient evaporation at moderate power levels, while controlled morphology helps minimize spitting and compositional drift during deposition.

Available options include customized purity grades, particle sizes, and packaging formats to suit different evaporation sources, such as boats, crucibles, and liners. Each batch can be supplied with full documentation to support R&D and production requirements.

Applications

  • Compound semiconductor thin films (e.g., CdTe, HgCdTe, Bi₂Te₃)

  • Infrared detectors and thermal imaging coatings

  • Photovoltaic absorber layers and buffer layers

  • Thermoelectric devices and functional films

  • Optical coatings and research-scale material studies

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialTellurium (Te)Core functional element for chalcogenide films
Purity99.9% – 99.999%Impurity control affects electrical & optical properties
FormPellets, granules, shots, piecesCompatible with different evaporation sources
Melting Point~449.5 °CEnables efficient thermal evaporation
Deposition MethodThermal / E-beam evaporationFlexible PVD compatibility
PackagingVacuum-sealed, inert protectedPrevents oxidation and contamination

Comparison with Related Materials (Optional)

MaterialKey AdvantageTypical Application
Tellurium Evaporation MaterialsPrecise chalcogen controlSemiconductor & IR films
SeleniumLower evaporation temperaturePhotovoltaic buffer layers
SulfurHigh vapor pressureChalcogenide research films

FAQ

QuestionAnswer
Can purity and particle size be customized?Yes, purity grade and physical form can be tailored to your process.
Is tellurium suitable for thermal evaporation?Yes, its melting point allows stable thermal and e-beam evaporation.
How is oxidation prevented during shipping?Materials are vacuum-sealed or packed under inert atmosphere.
Which industries use tellurium most?Semiconductor, photovoltaics, IR optics, thermoelectrics, and R&D.
Is documentation provided?Certificate of Analysis is available upon request.

Packaging

Our Tellurium Evaporation Materials are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. Each batch is vacuum-sealed or inert-gas packed with protective cushioning, ensuring the materials arrive in optimal condition without oxidation or physical damage.

Conclusion

Tellurium Evaporation Materials provide reliable composition control, stable evaporation behavior, and high purity for demanding thin film deposition processes. With flexible forms, customizable specifications, and consistent quality, they are well suited for both research-scale experiments and industrial coating applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com

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Tellurium (Te) Grain, 99.9999% Purity (6N), Te Granules 5N 3–6 mm 300 g

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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