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VD0582 Tellurium Evaporation Materials, Te

Catalog No.VD0582
MaterialTellurium (Te)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM is a leading manufacturer and supplier of high-purity tellurium evaporation materials, along with a diverse range of other evaporation materials. We provide these materials in both powder and granule forms, and we also offer customized options upon request.

Tellurium Evaporation Materials Description

Tellurium is a brittle, mildly toxic metalloid with a distinctive silver-white hue. It dissolves in sulfuric acid, nitric acid, aqua regia, potassium cyanide, and potassium hydroxide, but remains insoluble in both cold and hot water, as well as carbon disulfide. This versatile element finds applications across several industries, including semiconductor manufacturing, alloy production, and the creation of chemical raw materials, cast iron, rubber, and glass.

For high-precision deposition processes, the use of high-purity tellurium is essential to achieve top-notch film quality. TFM excels in providing tellurium evaporation materials with exceptional purity levels of up to 99.999%. Our rigorous quality assurance procedures ensure that these materials meet the highest standards of reliability and performance.

Tellurium Evaporation Materials Specification

Material TypeTellurium
SymbolTe
Color/AppearanceSilvery Lustrous Gray, Semi-Metallic
Melting Point449 °C
SynonymsTellurium pellets, Tellurium Pieces, Tellurium Evaporation Pellet, Te Pellets, Te Pieces, Te Evaporation Pellet
Density6.24 g/cm3
Thermal Conductivity1.97~3.0W/m.K

Tellurium Evaporation Materials Application

Tellurium plays a crucial role in various deposition techniques, such as semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). Additionally, it is utilized in optics for applications like wear protection, decorative coatings, and display technologies.

Tellurium Evaporation Materials Packaging

Our tellurium evaporation materials are meticulously managed to ensure they remain undamaged during storage and transportation. We take great care to preserve the integrity and quality of our products throughout the entire process.

Get Contact

TFM offers tellurium evaporation materials in a range of forms, purities, sizes, and price points. We focus on producing high-purity e-beam evaporation materials with exceptional density and minimal average grain sizes. For current pricing on evaporation pellets and other deposition materials not listed, please contact us directly with your inquiry.

FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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