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Tellurium Sputtering Target, Te with Titanium Backing Plate with Magnetic Keeper, Made by TFM

ST0993 Tellurium Sputtering Target, Te

Chemical FormulaTe
Catalog No.ST0993
CAS Number13494-80-9
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

TFM takes pride in its extensive knowledge and experience in offering competitively priced Tellurium Sputtering Targets with exceptional purity. With years of expertise in materials science, TFM ensures the delivery of high-quality targets that meet the rigorous standards required for nanotechnology and thin-film deposition applications.

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Tellurium Sputtering Target, Te with Titanium Backing Plate with Magnetic Keeper, Made by TFM Tellurium Sputtering Target, Te with Titanium Backing Plate with Magnetic Keeper, Made by TFM

Tellurium Sputtering Target

Introduction

The Tellurium Sputtering Target from Thin Film Materials (TFM) is a high-purity deposition material widely used in semiconductor, photovoltaic, and optoelectronic applications. Tellurium (Te), a brittle metalloid with semiconductor properties, is highly valued for its role in thin film fabrication due to its unique electrical and optical characteristics. When processed into sputtering targets, Tellurium enables the production of uniform thin films essential for advanced electronics and energy technologies.

Detailed Description

Tellurium sputtering targets are manufactured to ensure high density and excellent purity, typically in the range of 99.9% to 99.999%. This minimizes contamination and guarantees film quality during deposition.

  • Appearance: Silvery-gray, brittle crystalline solid

  • Density: ~6.24 g/cm³

  • Melting Point: 449.5 °C

  • Crystal Structure: Hexagonal

TFM provides Tellurium sputtering targets in standard disc, rectangular, and step target formats. We also offer bonding services with copper or titanium backing plates to enhance durability, improve thermal conductivity, and extend the target’s operational life. Custom machining is available to meet specific sputtering system requirements.

Applications

Tellurium sputtering targets are widely used for:

  • Semiconductors: compound semiconductors such as CdTe and HgCdTe for detectors and infrared devices

  • Photovoltaics: thin film solar cells, including CdTe-based solar modules

  • Optoelectronics: infrared optics, thermoelectric devices, and laser technologies

  • Research & Development: advanced studies in materials science, energy conversion, and nanotechnology

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.999%Ensures high-performance films with minimal impurities
Diameter25 – 150 mm (custom up to 300 mm)Fits standard and custom sputtering systems
Thickness3 – 6 mmDetermines sputtering rate and uniformity
Bonding OptionsIndium / ElastomerImproves adhesion, heat dissipation, and durability
Backing PlateCopper / TitaniumSupports stability during deposition

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Tellurium (Te)Semiconductor & IR sensitivityCdTe solar cells, IR optics
Cadmium Telluride (CdTe)High efficiency in photovoltaicsThin film solar modules
Selenium (Se)Cost-effective chalcogen elementOptoelectronics, glass coatings

FAQ

QuestionAnswer
Can Tellurium sputtering targets be customized?Yes, TFM provides custom sizes, thicknesses, and bonding services.
Do you offer bonded targets?Yes, targets can be bonded with indium or elastomer for enhanced performance.
What is the packaging method?Vacuum-sealed, protected with foam, and shipped in export-safe cartons or crates.
Which industries use Tellurium targets most?Photovoltaics, infrared optics, semiconductors, thermoelectrics, and R&D.

Packaging

Each Tellurium sputtering target is vacuum-sealed and securely packaged to protect against oxidation and mechanical damage. We ensure safe transport and long-term storage without compromising purity or performance.

Conclusion

The Tellurium (Te) Sputtering Target from TFM offers high purity, superior density, and reliable performance for thin film deposition. With customizable dimensions, bonding services, and consistent quality, our Tellurium targets are ideal for research laboratories and industrial production.

For detailed specifications, quotations, or custom solutions, please contact us at sales@thinfilmmaterials.com.

Order Now

Te Target 4N 150*50*3mm Indium Bonded 3mm Cu B/Plate, Te Target 4N 150*50*6mm Indium Bonded 6mm Cu B/Plate, Te Target 4N ø50.8*6.35mm (ø2” × 1/4”), Indium Bonded to Titanium B/Plate 3mm thick with keeper, Te Target 4N ø50.8*3mm (ø2” × 1/4”), Indium Bonded to Titanium B/Plate 3mm thick with keeper, Te Target 4N ø75*5mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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