Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
terbium-manganate-tbmno3-sputtering-target-removebg-preview-1

ST0472 Terbium Manganate Sputtering Target, TbMnO3

Chemical Formula: TbMnO3
Catalog Number: ST0472
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Terbium Manganate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Terbium Manganate Sputtering Target Description

Terbium Manganate Sputtering Target is made up of terbium, manganese, and oxygen. High-purity terbium manganate sputter targets are crucial in deposition processes to ensure the production of high-quality films. TFM specializes in creating sputtering targets with up to 99.9995% purity, employing rigorous quality assurance processes to guarantee product reliability.

Related products: Strontium Sputtering Target, Manganese Sputtering Target

Terbium Manganate Sputtering Target Specification

Material TypeTerbium Manganate
SymbolTbMnO3
Color/AppearanceSolid
Melting Point/
Density7.35 g/cm3
Type of BondElastomer, Indium
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Terbium Manganate Sputtering Target Application

Terbium Manganate Sputtering Target is utilized for various applications, including thin film deposition, decoration, semiconductors, displays, LEDs, and photovoltaic devices. It is also employed for functional coatings and in other sectors like optical information storage, glass coating for car and architectural glass, and optical communication.

Terbium Manganate Sputtering Target Packaging

Our Terbium Manganate Sputter Targets are meticulously handled to prevent damage during storage and transportation, ensuring they remain in pristine condition.

Get Contact

TFM offers Terbium Manganate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0472 Terbium Manganate Sputtering Target, TbMnO3”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top