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Terbium Oxide Sputtering Target

ST0192 Terbium Oxide Sputtering Target, Tb4O7

Chemical Formula: Tb4O7
Catalog Number: ST0192
CAS Number: 12036-41-8
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Terbium Oxide  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Terbium Oxide Sputtering Target Description

Terbium oxide sputtering target from TFM is an oxide sputtering material containing terbium (Tb) and oxygen (O).

TerbiumTerbium, symbolized as “Tb,” is a chemical element named after Ytterby, Sweden. It was first documented in 1842 by G. Mosander, who also successfully isolated it. Terbium has an atomic number of 65 and is found in the f-block of the periodic table, specifically in Period 6, Group 3. Its relative atomic mass is 158.92535(2) Dalton, with the number in brackets representing the uncertainty in the measurement.

Related Product: Terbium Sputtering Target

OxygenOxygen is an element with the chemical symbol “O,” derived from the Greek words ‘oxy’ (acid) and ‘genes’ (forming). It was discovered in 1771 by the chemist Carl Wilhelm Scheele, who also managed to isolate it. Oxygen has an atomic number of 8 and is located in Group 16 and Period 2 of the periodic table, which places it in the p-block. The element is well-known for its role in forming acids when combined with hydrogen. The standard atomic weight of oxygen is approximately 15.9994(3) Dalton, where the value in parentheses indicates the uncertainty. This element is crucial for many biological and chemical processes, making it an essential component of life on Earth.

Terbium Oxide Sputtering Target Specification

Material Type Terbium Oxide
Symbol Tb4O7
Color/Appearance Brown
Melting Point (°C) Decomposes to Tb2O3
Density  7900 kg/m-3
Molecular Weight 747.69
Exact Mass 174.92 g/mol

Terbium Oxide Sputtering Target Packaging

Our Tb4O7 Terbium Oxide Sputtering Target is meticulously tagged and labeled on the exterior for easy identification and stringent quality control. We take great care in handling and packaging to prevent any potential damage during storage or transportation, ensuring that the product reaches you in perfect condition.

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TFM offers Terbium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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