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ST0050 Terbium Sputtering Target, Tb

Chemical Formula: Tb
Catalog Number: ST0050
CAS Number: 7440-27-9
Purity: 99.9%,99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Terbium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Terbium Sputtering Target Description

Terbium

The terbium sputtering target is made from high-purity terbium metal. Terbium is a silvery-white, rare earth metal that is malleable, ductile, and soft enough to be cut with a knife. As the ninth member of the lanthanide series, terbium is a fairly electropositive metal that reacts with water, releasing hydrogen gas. Terbium is never found in nature as a free element, but it is contained in many minerals, including cerite, gadolinite, monazite, xenotime, and euxenite.

Terbium Sputtering Target Specification

Material Type Terbium
Symbol Tb
Atomic Weight 158.92535
Atomic Number 65
Color/Appearance Silvery White, Metallic
Melting Point 1,356 °C
Theoretical Density 8.27 g/cc
Sputter RF
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Terbium Sputtering Target Application

High-performance terbium sputtering materials are utilized in a variety of thin film coating applications, including CD-ROMs, decoration, flat panel displays, functional coatings, optical information storage, and glass coatings for automotive and architectural glass. These materials are also used in optical communication and other industries.

Additional Applications of Terbium

  • NdFeB Permanent Magnets: Terbium is an important additive for neodymium-iron-boron (NdFeB) permanent magnets, helping to raise the Curie temperature and improve temperature coefficient.
  • Magnetostrictive Alloy (TbDyFe): One of the most promising uses of distilled terbium metal is in the magnetostrictive alloy TbDyFe, which changes shape under a magnetic field.
  • Special Master Alloys: Terbium is used in the production of special master alloys.
  • Fuel Cells: Terbium is also applied in certain fuel cell technologies.

Terbium Sputtering Target Target Bonding Services

Specialized bonding services for Terbium Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Terbium Sputtering Target Packing

Our terbium sputter targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation. Due to terbium’s high chemical activity when exposed to the environment, we offer oil packaging and clean procedures to prevent chemical reactions and maintain the material’s integrity.

Get Contact

TFM offers Terbium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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