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ST0051 Thulium Sputtering Target, Tm

Chemical Formula: Tm
Catalog Number: ST0051
CAS Number: 7440-30-4
Purity: 99.5%, 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Thulium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Thulium Sputtering Target Description

Thulium

The thulium sputtering target is a silvery material composed of high-purity thulium metal. Thulium, symbolized as “Tm,” is a chemical element named after Thule, the ancient name for Scandinavia. It was first mentioned in 1879 and observed by T. Cleve, who later accomplished and announced its isolation. Thulium has an atomic number of 69 and is located in Period 6, Group 3 of the periodic table, within the f-block. Its relative atomic mass is 168.93421 Daltons, with the number in brackets indicating the measurement uncertainty.

Thulium Sputtering Target Specification

Material TypeThulium
SymbolTm
Color/AppearanceSilvery White, Metallic
Melting Point1,545 °C
Density9.32 g/cc
Thermal Conductivity0.169 W/cm/K
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Thulium Sputtering Target Application

The thulium sputtering target is primarily used for thin film deposition. Thulium has several other important applications:
  • Thulium Lasers: Thulium lasers require less cooling and perform well at high temperatures, making them suitable for use in satellites.
  • Alloys: Thulium is used in alloys along with other rare earth metals.
  • Doping YAG Lasers: Thulium is used to dope yttrium aluminum garnets (YAG) in lasers.
  • Euro Banknotes: Thulium’s blue fluorescence under UV light is utilized in euro banknotes to help prevent counterfeiting.

Get Contact

TFM offers Thulium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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