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VD0793 Tin(II) Fluoride Evaporation Materials, SnF2

Catalog No.VD0793
MaterialTin Fluoride (SnF2)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM excels in providing high-purity tin(II) fluoride evaporation materials. As a leading manufacturer and supplier, we offer a diverse range of evaporation materials, available in both powder and granule forms. We also accommodate custom form requests to meet specific needs.

MSDS File

Tin(II) Fluoride Evaporation Materials Overview

TFM provides high-purity tin(II) fluoride evaporation materials, with the chemical formula SnF2. This fluoride ceramic material is crucial for achieving high-quality deposited films in various deposition processes. Our manufacturing expertise ensures materials with purity levels up to 99.9995%, backed by rigorous quality assurance practices to ensure reliability.

in(II) Fluoride Evaporation Materials Specification

Material TypeTin(II) Fluoride
SymbolSnF2
Appearance/ColorColorless solid
Melting Point213 °C (415 °F; 486 K)
Density4.57 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications of Tin(II) Fluoride Evaporation Materials

Our tin(II) fluoride evaporation materials are used in a variety of deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are primarily applied in optics for wear protection, decorative coatings, and display technologies.

Packaging Information

TFM ensures that tin(II) fluoride evaporation materials are meticulously tagged and labeled for efficient identification and quality control. We take great care in packaging to prevent any damage during storage and transportation.

Contact Us

As a leading provider of high-purity tin(II) fluoride evaporation materials, TFM offers various forms, including tablets, granules, rods, and wires. Custom forms and quantities are available upon request. We also supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For inquiries about current prices or to request materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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