Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors

ST0194 Tin Oxide Sputtering Target, SnO2 & SnO

Chemical Formula: SnO2
Catalog Number: ST0194
CAS Number: 18282-10-5
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tin Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

SnO Tin Oxide Target

Tin Oxide Sputtering Targets, available in SnO₂ (tin dioxide) and SnO (tin monoxide) compositions, are widely used functional oxide materials in thin-film deposition. Thanks to their tunable electrical properties, optical transparency, and chemical stability, tin oxide targets play a critical role in transparent electronics, gas sensing, optoelectronics, and energy-related devices. Offering both oxidation states allows engineers and researchers to precisely tailor film behavior to specific application requirements.

Detailed Description

Tin oxide sputtering targets are manufactured from high-purity tin oxide powders with strictly controlled stoichiometry. Through optimized ceramic processing—powder synthesis, calcination, pressing, and high-temperature sintering—the targets achieve high density, uniform grain structure, and excellent compositional consistency. These characteristics are essential for stable plasma operation, reduced particle generation, and repeatable film performance.

SnO₂ is a wide-bandgap, n-type semiconductor oxide well known for its high optical transparency, chemical durability, and environmental stability. It is commonly used where transparent conductive or protective films are required.
SnO, with a lower oxidation state, exhibits different electrical behavior and defect chemistry, enabling more flexible control of conductivity and carrier type under suitable deposition conditions.

Using compound tin oxide targets simplifies process control compared with reactive sputtering from metallic tin, reducing oxygen flow sensitivity and improving batch-to-batch reproducibility. RF sputtering is typically recommended due to the semiconducting or insulating nature of these oxides.

Applications

Tin Oxide sputtering targets are commonly used in:

  • Transparent conductive films: Displays, touch panels, and optoelectronic devices

  • Gas and chemical sensors: Sensitivity driven by surface reactions and oxygen vacancies

  • Semiconductor devices: Buffer, window, and functional oxide layers

  • Optical coatings: Transparent and protective thin films

  • Energy devices: Electrodes and functional layers in batteries and photovoltaics

  • Research & development: Oxide electronics and defect-engineered thin films

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionSnO₂ or SnODetermines oxidation state and conductivity
Purity99.9% – 99.99%Minimizes defects and contamination
Diameter25 – 300 mm (custom)Compatible with standard sputtering cathodes
Thickness3 – 6 mm (typical)Affects target lifetime
Density≥ 95% of theoreticalEnsures stable sputtering behavior
Sputtering ModeRF (preferred)Suitable for oxide materials
BondingIndium / Elastomer / DirectImproves thermal and mechanical stability

Comparison with Related Oxide Materials

MaterialKey AdvantageTypical Application
SnO₂High transparency, chemical stabilityTCOs, sensors
SnOTunable conductivity, defect controlFunctional oxide layers
In₂O₃High transparencyDisplay coatings
ZnOEasy processing, low costSensors, optoelectronics

FAQ

QuestionAnswer
Can SnO₂ and SnO targets be customized?Yes, size, purity, density, and bonding options are available.
Which sputtering method is recommended?RF sputtering is generally preferred for tin oxide targets.
Can oxidation state be tuned during deposition?Yes, through target selection and process parameters.
How are the targets packaged?Vacuum-sealed with protective cushioning for safe transport.

Packaging

Our Tin Oxide Sputtering Targets (SnO₂ & SnO) are meticulously tagged and labeled to ensure accurate identification and strict quality control. Each target is vacuum-sealed and protected with reinforced cushioning to prevent contamination, moisture exposure, or mechanical damage during storage and transportation.

Conclusion

Tin Oxide Sputtering Targets in SnO₂ and SnO forms provide flexible, reliable solutions for depositing functional oxide thin films with controlled electrical and optical properties. With consistent quality, customizable configurations, and stable sputtering performance, these targets are well suited for both industrial production and advanced research applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

 

Order Now

SnO₂–CeO₂ Target TRG 1:1, 99.9% Purity, ø50.8×3.2mm (±0.1mm)

Reviews

There are no reviews yet.

Be the first to review “ST0194 Tin Oxide Sputtering Target, SnO2 & SnO”

Your email address will not be published. Required fields are marked *

Related Products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top