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ST0194 Tin Oxide Sputtering Target, SnO2

Chemical Formula: SnO2
Catalog Number: ST0194
CAS Number: 18282-10-5
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tin Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Tin Oxide Sputtering Target Description

Tin oxide sputtering targets from TFM are high-quality oxide sputtering materials composed of tin (Sn) and oxygen (O). These targets are designed for use in various thin film deposition processes and applications across different industries.

TinTin, also known by its Latin name “stannum,” is a chemical element that dates back to early use around 3500 BC. The name “tin” comes from the Anglo-Saxon word of the same spelling. It carries the chemical symbol “Sn,” derived from its Latin name. Tin has an atomic number of 50 and is positioned in Period 5, Group 14 of the periodic table, which places it in the p-block. The element has a relative atomic mass of 118.710(7) Dalton, with the number in parentheses indicating the measurement uncertainty.

Related Product: Tin Sputtering Target

Oxygen is a chemical element with the symbol “O,” derived from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first identified in 1771 by the scientist W. Scheele, who also isolated and officially reported it. Oxygen is a vital element in the periodic table, situated in Period 2, Group 16, which is part of the p-block. It has an atomic number of 8 and a relative atomic mass of 15.9994(3) Dalton, with the value in parentheses reflecting the uncertainty of the measurement.

Tin Oxide Sputtering Target Specification

Compound FormulaSnO2
Molecular Weight150.69
AppearanceWhite to gray solid
Melting Point1630 °C
Density6.95 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Tin Oxide Sputtering Target Handling Notes

1. Elastomer bonding is advised for the tin oxide sputtering target due to certain properties such as brittleness and low thermal conductivity, which make it less suitable for direct sputtering.

2. This material exhibits low thermal conductivity, making it prone to thermal shock.

Tin Oxide Sputtering Target Packaging

Our tin oxide sputtering target is meticulously tagged and labeled externally to ensure easy identification and maintain quality control. We take special care in handling and packaging to prevent any damage during storage or transportation, ensuring that the product arrives in perfect condition.

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TFM offers Tin Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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