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VD0826 Tin(IV) Sulfide Evaporation Materials, SnS2

Catalog No.VD0826
MaterialTin Sulfide (SnS2)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM is a top-tier manufacturer and supplier of premium-grade tin(IV) sulfide evaporation materials, alongside a broad range of other evaporation products. We provide these materials in both powder and granule forms, catering to various industrial needs. For specialized applications, we also offer custom forms tailored to your specific requirements, ensuring

MSDS File
Tin(IV) Sulfide Evaporation Materials Overview

Tin(IV) sulfide, represented by the chemical formula SnS₂, is a sulfide ceramic evaporation material that plays a key role in various deposition techniques. TFM specializes in manufacturing high-purity SnS₂ materials, offering up to 99.9995% purity to ensure excellent performance in deposition processes, contributing to high-quality thin films. TFM’s products are designed with rigorous quality assurance practices, ensuring reliability and consistency in every batch.

Related Products: Tin Evaporation Materials, Sulfide Ceramic Evaporation Materials

Specifications of Tin(IV) Sulfide Evaporation Materials

Material TypeTin(IV) sulfide
SymbolSnS2
Appearance/ColorGold-yellow solid
Melting Point600 °C (1,112 °F; 873 K)
decomposes
Density4.5 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications of Tin(IV) Sulfide Evaporation Materials

Tin(IV) sulfide is widely used in thin-film deposition processes, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). Its applications extend to optics, where it is utilized in wear-resistant coatings, decorative films, and display technologies.

Packaging Information

To ensure product integrity and ease of identification, TFM ensures that all Tin(IV) sulfide evaporation materials are clearly labeled and securely packaged. Each order is handled with care to prevent any damage during storage or transportation.

Contact Information

TFM is a trusted manufacturer and supplier of high-purity Tin(IV) sulfide evaporation materials. Available in various shapes such as powder, granules, rods, or custom designs, TFM can also offer other evaporation-related products such as sources, boats, filaments, crucibles, and e-beam crucible liners. For inquiries regarding pricing or custom orders, please feel free to reach out to TFM.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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