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ST0112 Tin Zinc Sputtering Target, Sn/Zn

Chemical Formula: Sn/Zn
Catalog Number: ST0112
CAS Number: 7440-31-5 | 7440
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tin Zinc sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

 

MSDS File

Tin Zinc Sputtering Target Description

The Tin Zinc Sputtering Target from TFM is an alloy material composed of tin (Sn) and zinc (Zn). This high-quality sputtering material is designed for applications that benefit from the combined properties of these two elements.

TinTin, also known by its Latin name stannum, is a chemical element that originated from the Anglo-Saxon word “tin” (stannum in Latin, meaning hard). It has been used since around 3500 BC. Represented by the symbol “Sn,” tin has an atomic number of 50 and is located in Period 5, Group 14 of the p-block in the periodic table. Its relative atomic mass is 118.710(7) Daltons, with the number in brackets indicating the measurement uncertainty.

Related Product: Tin (Sn) Sputtering Target

ZincZinc, symbolized as “Zn,” is a chemical element whose name originates from the German word ‘zinc,’ which may in turn be derived from the Persian word ‘sing,’ meaning stone. It has been used since before 1000 BC and was discovered by Indian metallurgists. Zinc has an atomic number of 30 and is located in Period 4, Group 12 of the d-block in the periodic table. Its relative atomic mass is 65.409(4) Daltons, with the number in brackets indicating the measurement uncertainty.

Related Product: Zinc Sputtering Target

Tin Zinc Sputtering Target Applications

The Tin Zinc Sputtering Target is widely used for thin film deposition in various industries. Its applications include decoration, semiconductors, displays, LED and photovoltaic devices, and functional coatings. Additionally, it is utilized in the optical information storage industry, glass coating for car and architectural glass, optical communication, and other related fields.

Tin Zinc Sputtering Target Packing

Our Tin Zinc Sputter Targets are meticulously tagged and labeled externally to ensure efficient identification and stringent quality control. We take great care to prevent any damage during storage and transportation, ensuring that our products arrive in perfect condition.

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TFM offers  Tin Zinc Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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