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VD0650 Titanium Aluminum Vanadium Evaporation Materials, Ti/Al/V

Catalog No.VD0650
MaterialTitanium Aluminum Vanadium
Purity99.9%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) excels as a premier producer and distributor of high-purity titanium, aluminum, and vanadium evaporation materials. We provide a broad selection of these materials, available in both powder and granule forms. For tailored requirements, custom forms can be requested to meet specific needs.

MSDS File

Titanium Aluminum Vanadium Evaporation Materials Overview

Thin-Film Mat Engineering (TFM) offers high-purity titanium, aluminum, and vanadium evaporation materials, essential for achieving superior film quality during deposition processes. Our alloy materials, containing titanium (Ti), aluminum (Al), and vanadium (V), are produced with exceptional purity levels of up to 99.9995%. We employ rigorous quality assurance procedures to ensure the reliability and performance of our products.

Applications

Our titanium, aluminum, and vanadium evaporation materials are versatile and used in various applications, including:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Coatings: Suitable for wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

To ensure efficient identification and maintain product integrity, our evaporation materials are clearly tagged and labeled. We prioritize careful handling to prevent any damage during storage and transportation.

Contact Us

At TFM, we provide evaporation materials in various forms, including tablets, granules, rods, and wires, with customized options available upon request. In addition, we offer a range of related products such as evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or to inquire about materials not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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