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Titanium Carbonitride Sputtering Target

ST0926 Titanium Carbonitride Sputtering Target, TiCN

Chemical FormulaTiCN
Catalog No.ST0926
CAS Number12654-86-3
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Titanium Carbonitride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Titanium Carbonitride Sputtering Target Description

Titanium Carbonitride Sputtering Target is a specialized material used in the sputtering process, a technique for depositing thin films onto a substrate. This process involves bombarding the target with high-energy ions, which causes atoms or molecules from the target material to be ejected. These ejected particles then deposit onto a substrate, forming a thin film with the properties of Titanium Carbonitride (TiCN).

TiCN Sputtering Targets are critical in applications where enhanced mechanical and protective properties are required. The thin films produced from TiCN targets are known for their exceptional hardness, wear resistance, and corrosion resistance, making them suitable for use in protective coatings and various industrial applications.

Related Product: Titanium Boride Sputtering Target

Titanium Carbonitride Sputtering Target Specifications

Compound FormulaTiCN
Molecular Weight121.75
AppearanceGray target
Melting Point>350
Density (g/cm3)5.08
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Titanium Carbonitride Sputtering Target Handling Notes

Indium bonding is recommended for the Titanium Carbonitride (TiCN) Sputtering Target due to its specific characteristics that can pose challenges during sputtering. Titanium Carbonitride is known for its brittleness and low thermal conductivity, which can make it susceptible to thermal shock and potential damage during the sputtering process.

Indium bonding helps mitigate these issues by providing a more reliable and stable attachment between the target and the backing plate, ensuring better thermal management and structural integrity throughout the sputtering process.

Titanium Carbonitride Sputtering Target Application

The Titanium Carbonitride (TiCN) Sputtering Target is employed in applications where thin films must possess high hardness, wear resistance, and corrosion resistance. TiCN coatings are particularly valued in the manufacturing of cutting tools, industrial components, and wear-resistant surfaces due to their ability to enhance the durability and performance of these items.

Titanium Carbonitride Sputtering Target Packaging

Our Titanium Carbonitride Sputtering Target is extensively utilized in the production of coatings for diverse applications. These include enhancing the wear resistance of tools, improving the durability of surfaces, and achieving specific optical or electrical properties.

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TFM offers Titanium Carbonitride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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