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Titanium Chromium Evaporation Materials

VD0651 Titanium Chromium Evaporation Materials, Ti/Cr

Catalog No.VD0651
MaterialTitanium Chromium (Ti/Cr)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) stands out as a top manufacturer and supplier of high-purity titanium chromium evaporation materials. We provide a diverse range of evaporation materials, available in both powder and granule forms. For specialized needs, we offer custom forms upon request to ensure optimal performance and suitability for your applications.

MSDS File
Titanium Chromium Evaporation Materials Overview

Our titanium chromium evaporation materials are premium alloys consisting of titanium (Ti) and chromium (Cr). Designed for high-performance applications, these materials are essential for achieving superior film quality in deposition processes. We at TFM are committed to delivering titanium chromium evaporation materials with exceptional purity levels, reaching up to 99.9995%. This high purity ensures reliable and consistent results in your deposition applications.

Applications of Titanium Chromium Evaporation Materials

Titanium chromium evaporation materials are versatile and find applications across various industries:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD), these materials are crucial for creating high-quality thin films.
  • Optical Coatings: Utilized in wear-resistant coatings, decorative finishes, and display technologies, they enhance both the functionality and aesthetics of optical components.

Packaging and Handling

Our titanium chromium evaporation materials are carefully packaged and clearly labeled to facilitate easy identification and quality assurance. We prioritize the protection of our products during storage and transit to prevent any potential damage.

Get in Touch

TFM is a leading provider of high-purity titanium chromium evaporation materials. We offer a variety of forms including tablets, granules, rods, and wires. Custom shapes and quantities are available upon request. Additionally, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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