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Titanium Cobalt (Ti/Co) Sputtering Target

ST0115 Titanium Cobalt (Ti/Co) Sputtering Target

Chemical Formula: Ti/Co
Catalog Number: ST0115
CAS Number: 7440-32-6 | 7440
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Titanium Cobalt sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Titanium Cobalt (Ti/Co) Sputtering Target

Introduction

The Titanium Cobalt (Ti/Co) Sputtering Target is a high-performance alloy target material engineered for advanced thin film deposition. By combining the mechanical resilience of titanium with the magnetic and catalytic properties of cobalt, this sputtering target is widely used in semiconductor processing, optical coatings, and energy-related applications. Its balanced composition allows researchers and industrial users to deposit functional thin films with tailored structural, magnetic, and electrochemical properties.

Detailed Description

Titanium Cobalt sputtering targets are produced through precision melting and sintering techniques to ensure a dense, uniform structure. Depending on application requirements, the Ti/Co ratio can be adjusted (commonly 50:50 at% or other tailored ratios).

Key characteristics include:

  • High Purity (≥99.9%) – critical for minimizing film contamination and achieving consistent deposition.

  • Strong Mechanical Integrity – titanium provides toughness and stability during sputtering.

  • Magnetic & Electronic Versatility – cobalt contributes magnetic functionality and electronic activity.

  • Custom Bonding Options – Indium, elastomer, or copper backing plates are available for improved heat transfer and mechanical stability in high-power sputtering environments.

This combination of properties makes Ti/Co sputtering targets ideal for producing alloy thin films used in magnetic storage, wear-resistant coatings, and catalytic layers.

Applications

Titanium Cobalt (Ti/Co) Sputtering Targets are utilized in:

  • Semiconductor Devices – deposition of functional alloy thin films.

  • Magnetic Storage Media – thin film coatings for data storage applications.

  • Optical Coatings – coatings requiring tailored reflectivity and durability.

  • Catalysis Research – preparation of catalytic thin films for energy and chemical processes.

  • Protective & Decorative Coatings – wear-resistant and functional surfaces in industrial applications.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%High purity improves film quality
CompositionTi/Co (50:50 at%, customizable)Enables tailored properties
Diameter25 – 200 mm (customizable)Compatible with various sputtering systems
Thickness3 – 10 mmAffects sputtering rate and film uniformity
BondingIndium / Elastomer / Copper backingEnsures thermal stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Titanium Cobalt (Ti/Co)Magnetic & catalytic propertiesMagnetic films, catalysis, wear-resistant coatings
Pure TitaniumCorrosion resistance, biocompatibilityMedical coatings, aerospace
Pure CobaltStrong ferromagnetismMagnetic storage, alloys

FAQ

QuestionAnswer
Can the Ti/Co ratio be customized?Yes, we provide standard and tailored atomic ratios based on application needs.
How are the targets packaged?Each target is vacuum-sealed, foam-protected, and shipped in export-ready cartons or wooden crates.
Which industries use Ti/Co targets most?Electronics, magnetic storage, catalysis, and thin film R&D.
Can it be bonded to a backing plate?Yes, indium and copper bonding services are available.
What deposition methods are supported?Primarily magnetron sputtering, both DC and RF systems.

Packaging

Our Titanium Cobalt Sputtering Targets are carefully vacuum-packed with moisture protection and external labeling for easy identification. Foam and shock-resistant export packaging ensures safe transport and long-term storage without compromising quality.

Conclusion

The Titanium Cobalt (Ti/Co) Sputtering Target offers a unique balance of structural stability, magnetic functionality, and catalytic potential, making it an indispensable material for advanced thin film research and production. Its high purity, customizable composition, and reliable bonding options ensure performance consistency across industries.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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