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Titanium Cobalt (Ti/Co) Sputtering Target

ST0115 Titanium Cobalt (Ti/Co) Sputtering Target

Chemical Formula: Ti/Co
Catalog Number: ST0115
CAS Number: 7440-32-6 | 7440
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Titanium Cobalt sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Titanium Cobalt (Ti/Co) Sputtering Target Description

TFM offers high-purity Titanium Cobalt (Ti/Co) sputtering targets, engineered for advanced thin film deposition applications where precise alloy compositions and uniformity are critical. These targets are typically composed of a binary alloy of titanium (Ti) and cobalt (Co) and can be tailored in atomic or weight ratios to meet specific research or industrial needs.

Ti/Co alloy films are used in a variety of technologies including:

  • Magnetic storage devices

  • Spintronic components

  • Protective and wear-resistant coatings

  • Catalysts for hydrogen evolution reactions (HER)

  • Electrodes for energy storage devices

The combination of titanium’s corrosion resistance and cobalt’s magnetic and catalytic properties enables these films to perform in harsh environments or under functional loading in electrochemical systems.

Titanium Cobalt (Ti/Co) Sputtering Target Specification

PropertyValue
Chemical CompositionTi/Co Alloy (e.g., Ti:Co = 50:50, customizable)
Purity≥ 99.9% (3N) or higher
AppearanceMetallic, gray to bluish-gray
FormAlloyed or composite sputtering target
Available RatiosTi:Co = 70:30, 50:50, 30:70 (custom ratios available)
DensityVaries by composition (~6.5–8.0 g/cm³)
Available SizesDia.: 1″, 2″, 3″, 4″, 5″, 6″
Thick: 0.125″, 0.250″
Backing Plate OptionsCopper, molybdenum, stainless steel

Custom compositions and co-sputtering solutions available on request.

Titanium Cobalt Sputtering Target Handling Notes

  1. Proper bonding is recommended for enhanced thermal conductivity and stability during sputtering.

  2. Handle targets with gloves in a clean environment to prevent surface contamination.

  3. Ensure uniform cooling and avoid sudden temperature changes to prevent mechanical stress or warping.

Titanium Cobalt Sputtering Target Packaging

Each Ti/Co sputtering target is vacuum-sealed or packaged under inert gas and securely placed in foam-padded containers to prevent oxidation and mechanical damage during storage or transportation. Labels include composition, dimensions, purity, and lot number for traceability.

Get Contact

TFM specializes in producing Titanium Cobalt sputtering targets with customizable ratios, sizes, and bonding options for use in magnetron sputtering, PVD systems, and thin film research.
Contact us to receive a quote or technical consultation tailored to your application.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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