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ST0115 Titanium Cobalt (Ti/Co) Sputtering Target

Chemical Formula: Ti/Co
Catalog Number: ST0115
CAS Number: 7440-32-6 | 7440
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Titanium Cobalt sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Chemical Elements

Titanium

Titanium, symbolized as “Ti,” is a chemical element named after the Titans, figures in Greek mythology who were the sons of the Earth goddess. It was first identified in 1791 by W. Gregor, and its isolation was later achieved and announced by J. Berzelius. Titanium holds the atomic number 22 on the periodic table and is positioned in Period 4, Group 4 within the d-block. Its relative atomic mass is 47.867(1) Daltons, with the number in brackets denoting the measurement uncertainty.

Cobalt

Cobalt, symbolized as “Co,” is a chemical element whose name comes from the German word ‘kobald,’ meaning goblin. It was first mentioned and observed by G. Brandt in 1732. Cobalt has an atomic number of 27 and is located in Period 4, Group 9 of the d-block in the periodic table. Its relative atomic mass is 58.933195(5) Daltons, with the number in brackets indicating the measurement uncertainty.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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