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VD0839 Titanium Diboride Evaporation Materials, TiB2

Catalog No.VD0839
MaterialTitanium Boride (TiB2)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM stands at the forefront of producing and supplying top-quality titanium diboride evaporation materials. Our offerings include a diverse range of high-purity materials designed for various applications. We provide these materials in both powder and granule forms, with the added option of customized forms tailored to your specific needs.

 

MSDS File

itanium Diboride Evaporation Materials Overview

Titanium diboride (TiB₂) is a high-performance boride ceramic crucial for various evaporation processes. Offered by TFM, this material boasts exceptional purity, reaching up to 99.9995%. TFM ensures that each batch adheres to strict quality standards, providing reliable performance in diverse deposition applications.

Specifications of Titanium Diboride Evaporation Materials

Material TypeTitanium diboride
SymbolTiB2
Appearance/ColorGray Solid
Melting Point3,230 °C (5,850 °F; 3,500 K)
Density4.52 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications of Titanium Diboride Evaporation Materials

TiB₂ evaporation materials are essential for several deposition techniques, including:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

These materials are widely used in:

  • Optical Coatings
  • Wear Protection
  • Decorative Coatings
  • Displays

Packaging and Quality Assurance

TFM ensures that titanium diboride evaporation materials are clearly tagged and labeled for easy identification and quality control. Careful handling during storage and transportation helps prevent any damage, preserving the material’s quality until it reaches its destination.

Contact Information

As a leading manufacturer and supplier of high-purity titanium diboride evaporation materials, TFM offers a range of shapes, including tablets, granules, rods, and wires. Custom forms and quantities are available upon request. Additionally, TFM provides various evaporation sources, such as boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and further inquiries, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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