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VD0736 Titanium Dioxide Evaporation Materials, TiO2

Material Type: Titanium (IV) Oxide
Symbol: TiO2
Purity: 99.9% ~ 99.99%
Shape: Powder/ Granule/ Custom-made

TFM stands out as a top manufacturer and supplier of premium titanium dioxide (TiO2) evaporation materials, recognized for our high purity standards. Our extensive product range includes evaporation materials available in both powder and granule forms. We also offer customized solutions to meet specific needs upon request, ensuring our clients receive precisely what they require.

Titanium Dioxide Evaporation Materials Overview

TFM provides high-quality titanium dioxide (TiO2) evaporation materials, essential for various deposition processes. With the chemical formula TiO2, our materials are known for their high purity, reaching up to 99.9995%. These high standards are maintained through rigorous quality assurance processes to ensure reliability and superior performance in deposited films.

Product Specifications

Material TypeTitanium Dioxide
SymbolTiO2
Appearance/ColorWhite solid
Melting Point1,843 °C (3,349 °F; 2,116 K)
Density4.23 g/cm3 (rutile)
3.78 g/cm3 (anatase)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Applications

Our titanium dioxide evaporation materials are versatile and widely used in:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Uses: Employed in wear protection, decorative coatings, and displays.

Packaging and Quality Control

To ensure the highest standards, our titanium dioxide materials are carefully tagged and labeled for clear identification. We take extensive measures to prevent any damage during storage and transportation.

Contact Us

TFM is a leading provider of high-purity titanium dioxide evaporation materials. We offer a variety of shapes including tablets, granules, rods, and wires, with custom options available upon request. Additionally, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and to request customized solutions, please contact us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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