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VD0794 Titanium(III) Fluoride Evaporation Materials, TiF3

Catalog No.VD0794
MaterialTitanium Fluoride (TiF3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM stands out as a premier manufacturer and supplier specializing in high-purity titanium(III) fluoride for evaporation processes, along with an extensive range of other evaporation materials. Our products come in both powder and granule forms, with customization options available to meet specific needs. Whether you require standard or tailored solutions, TFM is committed to delivering high-quality materials to support your evaporation applications.

MSDS File

Titanium(III) Fluoride Evaporation Materials Overview

TFM offers high-quality titanium(III) fluoride evaporation materials with the chemical formula TiF3. This fluoride ceramic material is essential for deposition processes, ensuring the creation of high-quality films. TFM’s TiF3 evaporation materials are produced with a purity level reaching up to 99.9995%, thanks to stringent quality assurance processes that guarantee reliability and performance.

Titanium(III) Fluoride Evaporation Materials Specification

Material TypeTitanium(III) Fluoride
SymbolTiF3
Appearance/ColorViolet to Purple-red Solid
Melting Point1,200 °C (2,190 °F; 1,470 K)
Density3.4 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications

Titanium(III) fluoride evaporation materials are widely used in various deposition techniques, including:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

These materials are especially valuable for applications in optics, such as wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our titanium(III) fluoride evaporation materials are carefully tagged and labeled to facilitate easy identification and quality control. We ensure that the materials are well-protected during storage and transportation to prevent any potential damage.

Contact Us

As a leading provider of high-purity titanium(III) fluoride evaporation materials, TFM offers various forms including tablets, granules, rods, and wires. We also provide custom shapes and quantities upon request. In addition to evaporation materials, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or to inquire about other materials not listed, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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