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Titanium Monoxide Sputtering Target, TiO

Chemical Formula: TiO
Catalog Number: TFM-SPT-0617
CAS Number: 12137-20-1
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Titanium Monoxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Product Overview

Titanium Monoxide Sputtering Target (TiO) is a ceramic sputtering target used to deposit composition-specific oxide thin films. Compared with metallic targets, oxide targets are typically more sensitive to density, porosity, brittleness, thermal shock, and bonding design. In practice, target microstructure, thickness, cooling conditions, and the chosen sputtering mode can all affect arc stability, particle generation, and deposited-film performance.


Titanium
Oxygen

Material and Deposition Characteristics

RF magnetron sputtering is commonly considered for insulating or semiconducting oxide targets, while sufficiently conductive formulations may allow alternative power modes in some systems. Target density and microstructural uniformity matter because pores, cracks, and local inhomogeneities can contribute to unstable plasma, particles, or target damage. For brittle ceramics, bonded assemblies and gradual power ramping are often worth evaluating.

Technical Data

Compound FormulaTiO
Molecular Weight63.8664
AppearanceBronze crystals
Melting Point1750 °C
Density4.95 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Typical Thin-Film Applications

  • Dielectric, insulating, optical, magnetic, protective, or functional ceramic thin films
  • Semiconductor, sensor, photonic, and multilayer coating research
  • Applications where oxide composition, density, and process stability affect film performance

Target Configuration and Ordering Considerations

When requesting a quotation, provide target diameter or rectangular dimensions, thickness, purity or composition, required quantity, and whether a backing plate or bonded assembly is needed. For brittle ceramic or compound targets, it is useful to specify the cathode model, backing-plate material, preferred bonding method, operating power if known, and any density, tolerance, or inspection-document requirements. TFM can review drawings, old-target photos, and application details when custom dimensions are required.

Frequently Asked Questions

Is Titanium Monoxide better suited to RF or DC sputtering?

RF magnetron sputtering is commonly considered for insulating or semiconducting oxide targets. If a specific formulation is sufficiently conductive, other modes may also be possible, but the equipment and target properties should be confirmed.

Why is density important for a Titanium Monoxide target?

Density and microstructural uniformity affect erosion stability, thermal behavior, and particle risk. Pores, cracks, or local density variations can contribute to unstable sputtering and target damage.

Should a Titanium Monoxide target be bonded to a backing plate?

Bonding is often useful for brittle oxide targets because it can improve mechanical support and heat transfer. The backing material and bonding method should be chosen according to target size, thickness, and operating conditions.

Will the deposited film always have the same composition as TiO?

Not always. Film composition can be affected by preferential sputtering, reactive gas, substrate temperature, re-sputtering, and chamber conditions. Composition-sensitive films should be verified after deposition.

How should power be ramped on a brittle Titanium Monoxide target?

A conservative power ramp and stable cooling are generally advisable. The exact operating procedure should follow the target size, bonding condition, cathode design, and supplier recommendations rather than a universal wattage.

What information should I provide when ordering Titanium Monoxide?

Provide formula or composition, purity, dimensions, quantity, backing and bonding requirements, cathode model or drawing, and any density, tolerance, or inspection requirements.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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