Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
titanium-monoxide-sputtering-target-tio-removebg-preview

ST0198 Titanium Monoxide Sputtering Target, TiO

Chemical Formula: TiO
Catalog Number: ST0198
CAS Number: 12137-20-1
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Titanium Monoxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Titanium Monoxide Sputtering Target Description

Titanium monoxide sputtering target from TFM is an oxide sputtering material with the chemical formula TiO. This material is known for its unique properties and is used in various advanced applications. The titanium monoxide sputtering target is particularly valued in thin film deposition processes, offering distinct characteristics that make it suitable for specialized industrial uses.

TitaniumTitanium, a chemical element, takes its name from the Titans of Greek mythology, the sons of the Earth goddess. It was first identified in 1791 by William Gregor, with its isolation later achieved and publicized by Jöns Jakob Berzelius. The symbol for titanium in the periodic table is “Ti,” and it has an atomic number of 22. Titanium is located in Period 4, Group 4, within the d-block of the periodic table. Its relative atomic mass is 47.867(1) Dalton, where the figure in brackets indicates the measurement uncertainty.

Related Product: Titanium Sputtering Target

OxygenOxygen is a chemical element with the symbol “O” and atomic number 8. Its name comes from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. The element was first described in 1771 by Carl Wilhelm Scheele, who also accomplished its isolation. Positioned in Period 2 and Group 16 of the periodic table, oxygen belongs to the p-block elements. The relative atomic mass of oxygen is 15.9994(3) Dalton, with the number in parentheses indicating the uncertainty in measurement.

Titanium Monoxide Sputtering Target Specification

Compound FormulaTiO
Molecular Weight63.8664
AppearanceBronze crystals
Melting Point1750 °C
Density4.95 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Titanium Monoxide Sputtering Target Packaging

Our titanium monoxide sputtering targets are meticulously tagged and labeled externally to ensure accurate identification and quality control. We take great care in handling and packaging to prevent any potential damage during storage or transportation, ensuring that the products reach you in pristine condition.

Get Contact

TFM offers Titanium Monoxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0198 Titanium Monoxide Sputtering Target, TiO”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top