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ST0994 Titanium Silicon Sputtering Target, Ti-Si

Chemical FormulaTi-Si
Catalog No.ST0994
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

TFM offers Titanium Silicon Sputtering Targets in a variety of forms, purities, and sizes. We specialize in producing high-purity physical vapor deposition (PVD) materials with maximum density and minimal average grain sizes, making them ideal for use in semiconductor applications, chemical vapor deposition (CVD), and PVD processes for display and optical technologies.

MSDS File

Titanium Silicon Sputtering Target Description

The Titanium Silicon Sputtering Target is a high-performance material, known for its high purity, density, sputtering rate, and strong adhesion. It also boasts excellent mechanical properties and low resistivity, making it an ideal choice for producing high-quality sputtered films. These films find widespread use in electronics, optics, chemistry, automotive, aerospace, and medical industries. The target’s high purity ensures that the resulting sputtered films are both pure and highly conductive, while its high density minimizes pores and impurities, enhancing the films’ density and stability. Additionally, Titanium Silicon Sputtering Targets possess excellent mechanical strength, allowing them to withstand energetic particle impacts and high-temperature environments. The low resistivity of these targets improves current transfer efficiency and reduces energy loss. These exceptional properties make Titanium Silicon Sputtering Targets a critical material for supporting various high-tech applications with reliability and precision.

Related Product: Aluminum Silicon Sputtering Target, Silicon Carbide Sputtering Target

 

Titanium Silicon Sputtering Target Specifications

Compound FormulaTi-Si
AppearanceSilver Metallic Target
Melting Point–
Density4.37
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Titanium Silicon Sputtering Target Handling Notes

Indium bonding is highly recommended for the Titanium Silicon Sputtering Target due to certain characteristics that make it challenging for direct sputtering, such as its brittleness and low thermal conductivity. These properties make the material susceptible to thermal shock, further emphasizing the need for proper bonding to ensure optimal performance during the sputtering process.

Titanium Silicon Sputtering Target Application

Titanium Silicon Sputtering Targets are versatile materials used across various industries, including electronics, optics, chemistry, automotive, aerospace, and medicine.

Electronics: These targets are essential in producing electronic components such as thin film resistors, capacitors, and transistors.

Optics: In the optics field, Titanium Silicon Sputtering Targets are utilized to create optical components like mirrors, windows, and gratings.

Chemistry: They are employed in the chemical industry to manufacture equipment like chemical reactors and reaction towers.

Automotive: Titanium Silicon Sputtering Targets play a crucial role in producing automotive components, including engine parts, transmission systems, and structural body parts.

Aerospace: In aerospace, these targets are used to fabricate aircraft and spacecraft components, such as engine parts and solar panels for spacecraft.

Medical: The medical industry benefits from Titanium Silicon Sputtering Targets in the production of medical devices and equipment, including surgical instruments, diagnostic tools, and pharmaceutical machinery.

Titanium Silicon Sputtering Target Packaging

We take great care in handling our Titanium Silicon Sputtering Target during storage and transportation to ensure it maintains its original quality and condition.

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TFM offers Titanium Silicon Sputtering Targets in a variety of forms, purities, and sizes. We specialize in producing high-purity physical vapor deposition (PVD) materials with maximum density and minimal average grain sizes, making them ideal for use in semiconductor applications, chemical vapor deposition (CVD), and PVD processes for display and optical technologies.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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