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Titanium Ti Rotary Sputtering Target

Titanium (Ti) Rotary Sputtering Target

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Titanium Ti Rotary Sputtering Target

TFM offers high-quality Titanium Ti rotary sputtering targets, ideal for thin-film deposition in a wide range of advanced applications, including semiconductors, coatings, and electronics. Titanium Ti targets are renowned for their high strength, light weight, and corrosion resistance, making them perfect for thin-film applications that require reliable performance in harsh environments.

The rotary sputtering target design ensures uniform and efficient deposition of Titanium Ti films, which are widely used in protective coatings, optical films, and electrical components. Titanium Ti films provide excellent adhesion, making them ideal for barrier layers and conductive films in electronics, photovoltaics, and magnetic storage devices. Additionally, Titanium nitride (TiN) films, created from Titanium targets, are highly valued in hard coating applications due to their superior wear resistance and high hardness.

Titanium Ti films are frequently used in decorative coatings for their aesthetic appeal and durability, as well as in catalyst supports for chemical reactions. Titanium oxide (TiO₂) films are also produced from Titanium targets and are widely employed in optical coatings, solar cells, and photocatalytic applications due to their optical properties and UV resistance.

TFM provides customized Titanium Ti rotary sputtering targets, ensuring precise control over material purity and composition to meet the requirements of high-performance applications. These targets deliver consistent and reliable results for thin-film deposition in industries such as electronics, solar energy, aerospace, and medical devices.

Our Titanium Ti rotary sputtering targets are manufactured to the highest standards, offering superior material quality and consistent sputtering performance. With low impurity levels, high density, and optimized sputtering characteristics, TFM’s Titanium Ti targets are ideal for producing high-quality thin films for next-generation technologies.

Specifications

Materials Titanium Rotary Sputtering Target
Symbol Ti
Theoretical Density (g/cc) 4.5
Melting Point (°C) 1660
Production Method Spraying Type, Monolithic Type
Size As per customer’s drawings
Grain Sizes <100 µm

Applications

  • Thin Film Photovoltaic Solar Industry
  • Semiconductor Electronics Industry
  • Flat Panel Display Industry
  • Construction / Automotive Glass Industry
  • Decorative / Functional Coating Industry

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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