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ST0195 Titanium Trioxide Sputtering Target, Ti2O3

Chemical Formula: Ti2O3
Catalog Number: ST0195
CAS Number: 1344-54-3
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Titanium Trioxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Titanium Trioxide Sputtering Target Description

Titanium trioxide sputtering target from TFM is an oxide sputtering material composed of titanium (Ti) and oxygen (O).

TitaniumTitanium is a chemical element named after the Titans of Greek mythology, known for their strength. It was first identified in 1791 by the English mineralogist William Gregor and later isolated by the Swedish chemist Jöns Jacob Berzelius. The symbol for titanium is “Ti,” and it has an atomic number of 22. Titanium is positioned in Period 4, Group 4 of the periodic table, within the d-block. The element’s relative atomic mass is 47.867(1) Dalton, with the number in brackets indicating the measurement uncertainty. Titanium is valued for its strength, corrosion resistance, and light weight, making it useful in various applications, including aerospace, medical implants, and sports equipment.

Related Product: Titanium Sputtering Target

OxygenOxygen, a fundamental chemical element, derives its name from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. This essential element was first documented in 1771 by the chemist Carl Wilhelm Scheele, who also successfully isolated it. The chemical symbol for oxygen is “O,” and it has an atomic number of 8. In the periodic table, oxygen is located in Period 2 and Group 16, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in brackets indicating the measurement uncertainty. Oxygen is crucial for life on Earth, playing a key role in respiration and the formation of water and other essential compounds.

Titanium Trioxide Sputtering Target Specification

Material TypeTitanium Trioxide
Compound FormulaTi2O3
Molecular Weight143.73 g/mol
AppearanceViolet black solid
Melting Point2,130° C (3,866° F)
Type of BondIndium

Titanium Trioxide Sputtering Target Bonding Service

Indium bonding is available for Titanium Trioxide Sputtering Targets. TFM is committed to machining standard backing plates and collaborates with Taiwan Bonding Company to offer specialized bonding services. For inquiries about bonding materials, methods, and services, please refer to our detailed information available here.

Titanium Trioxide Sputtering Target Packaging

Our Titanium Trioxide Sputtering Target is meticulously tagged and labeled externally to ensure clear identification and maintain high-quality control standards. We take extensive precautions to prevent any damage during storage and transportation, ensuring that the product arrives in perfect condition.

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TFM offers Titanium Trioxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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