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ST0195 Titanium Trioxide Sputtering Target, Ti2O3

Chemical Formula: Ti2O3
Catalog Number: ST0195
CAS Number: 1344-54-3
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Titanium Trioxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Titanium Trioxide (Ti₂O₃) is a transition metal oxide with unique electrical and optical characteristics, making it highly valuable in advanced thin film deposition. As a sputtering target material, Ti₂O₃ is particularly attractive for applications requiring controlled conductivity, optical absorption, and stable oxide film formation. It is widely used in semiconductor research, optical coatings, and functional thin films.

Detailed Description

Titanium Trioxide Sputtering Targets are typically fabricated through ceramic processing methods such as powder synthesis, pressing, and high-temperature sintering. Achieving the correct Ti³⁺ oxidation state and phase stability is critical, as Ti₂O₃ exhibits different electronic behavior compared to more common oxides like TiO₂.

These targets are characterized by high density and controlled stoichiometry, which directly influence sputtering stability and film quality. Compared with insulating oxides, Ti₂O₃ demonstrates semiconducting to metallic-like conductivity depending on temperature and oxygen content, making it suitable for specialized electronic and optical applications.

Due to its ceramic nature, Ti₂O₃ targets are often bonded to metallic backing plates (such as copper) using indium or elastomer bonding techniques. This improves thermal conductivity, reduces thermal stress, and minimizes the risk of cracking during sputtering.

The microstructure and purity of Ti₂O₃ are essential for consistent deposition. High-density targets reduce particle generation, while precise stoichiometry ensures reproducible film properties, particularly in applications involving optical absorption or electronic transport.

Applications

Titanium Trioxide Sputtering Targets are used in a range of advanced applications, including:

  • Semiconductor thin films and functional oxide layers
  • Optical coatings with controlled absorption properties
  • Resistive switching devices and oxide electronics
  • Infrared and photonic materials research
  • Protective and functional coatings in high-temperature environments
  • Research in correlated electron materials and transition metal oxides

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.5% – 99.99%Ensures stable film composition
Density≥ 95% theoreticalReduces porosity and particle generation
Diameter50 – 200 mm (custom available)Compatible with sputtering systems
Thickness3 – 6 mmInfluences sputtering lifetime
BondingIndium / Elastomer / Copper backingImproves thermal management
PhaseTi₂O₃ (controlled stoichiometry)Determines electrical and optical behavior

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Ti₂O₃Tunable conductivity, unique oxide phaseFunctional oxide films
TiO₂Excellent dielectric and optical propertiesOptical coatings, photocatalysis
TiOHigher conductivityConductive oxide films

FAQ

QuestionAnswer
Can Ti₂O₃ sputtering targets be customized?Yes, size, purity, density, and bonding options can be tailored to your requirements.
What sputtering method is suitable for Ti₂O₃?RF magnetron sputtering is typically recommended for oxide materials.
Why is stoichiometry important for Ti₂O₃?It directly affects electrical conductivity and optical properties of the deposited film.
Are bonded targets necessary?Bonded targets improve thermal stability and reduce the risk of cracking during sputtering.
Which industries use Ti₂O₃ targets?Semiconductor R&D, optics, and advanced materials research institutions.

Packaging

Our Titanium Trioxide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

Titanium Trioxide Sputtering Targets offer a unique combination of electrical tunability and optical functionality, making them ideal for advanced thin film applications. With precise composition control, high density, and customizable configurations, Ti₂O₃ targets provide reliable performance for both research and industrial environments.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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