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ST0510 Titanium Zirconium Sputtering Target, Ti/Zr

Chemical Formula: Ti/Zr
Catalog Number: ST0510
Purity: 99%~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Titanium Zirconium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Titanium Zirconium Sputtering Target Description

Discover the exceptional properties of Titanium Zirconium Sputtering Targets and their versatile applications across various industries. This page highlights the unique qualities of integrating Titanium and Zirconium in thin film deposition, offering insights into innovative possibilities.

Titanium: A Spectrum of Excellence

Titanium, a lustrous transition metal with a silver color, is known for its low density and exceptional strength. Its high resistance to corrosion in environments like seawater, aqua regia, and chlorine makes it highly valuable. Titanium sputtering targets are crucial in manufacturing CD-ROMs, decorative features, flat panel displays, functional coatings, and are essential in optical communication and advanced glass coating technologies.

Zirconium: The Power of Transition

Zirconium, with the symbol Zr and atomic number 40, is a durable transition metal characterized by its grey-white luster. It shares similarities with hafnium and titanium, and is valued for its refractory properties and excellent corrosion resistance. Zirconium is used as an alloying agent and in various compounds such as zirconium dioxide and zirconocene dichloride.

Related Products: Titanium Sputtering Target, Zirconium Sputtering Target.

Titanium Zirconium Sputtering Target Specifications

SpecificationDetails
Material TypeTitanium Zirconium
SymbolTi/Zr
Color/AppearanceSolid
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″, Thick: 0.125″, 0.250″. Custom shapes and sizes available on inquiry.
PackingTargets are tagged and labeled externally for identification and quality control. Careful handling during storage and transportation.

Titanium Zirconium Sputtering Target Applications

Advanced Thin Film Deposition: Titanium Zirconium sputtering targets are essential for producing thin films used in CD-ROMs, advanced displays, and functional coatings.

Resilient Alloying: Zirconium’s superior corrosion resistance and refractory qualities make it an excellent choice for alloying.

Innovations Galore: The combination of Titanium and Zirconium drives progress in semiconductor technology, chemical vapor deposition (CVD), physical vapor deposition (PVD), and optical industries.

Titanium Zirconium Sputtering Target Advantages

Enhanced Durability: The combination of Titanium and Zirconium results in thin films with superior durability, ensuring extended performance.

Diverse Applications: From CD-ROMs to advanced glass coatings, Titanium Zirconium sputtering targets demonstrate versatile uses.

Fueling Innovation: The integration of these metals fosters innovation in industries seeking advanced solutions.

Unlock the potential of Titanium Zirconium Sputtering Targets and leverage their unique properties for groundbreaking applications. Contact us today to explore customized solutions that propel your innovation forward.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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