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Titanium Zirconium Vanadium Sputtering Target, TiZrV

Titanium Zirconium Vanadium (TiZrV) Sputtering Target

Introduction

 

The Titanium Zirconium Vanadium (TiZrV) Sputtering Target is a specialized alloy material widely used in thin film deposition processes. Known for its ability to deliver high-performance coatings with excellent adhesion and stability, TiZrV targets play an essential role in vacuum technology, surface engineering, and advanced semiconductor applications. Its unique combination of three transition metals makes it a preferred choice for demanding research and industrial environments.

Detailed Description

TiZrV sputtering targets are typically manufactured in controlled alloy ratios (e.g., 1:1:1 at%), ensuring consistency and uniformity in film deposition. Each element contributes distinct properties:

  • Titanium (Ti): Provides excellent adhesion and corrosion resistance.

  • Zirconium (Zr): Enhances thermal stability and chemical resistance.

  • Vanadium (V): Improves mechanical strength and oxidation resistance.

The alloy is produced through powder metallurgy or vacuum melting techniques, followed by precision machining to meet tight tolerances in diameter and thickness. High-purity raw materials (up to 99.9%–99.99%) are used to minimize contamination, which is crucial for sensitive thin film applications.

Applications

TiZrV sputtering targets are employed in a wide range of industries:

  • Vacuum technology: Getter films for maintaining ultra-high vacuum (UHV) environments.

  • Semiconductors: Barrier and adhesion layers in microelectronic devices.

  • Optics: Thin film coatings for mirrors and precision optical components.

  • Surface protection: Wear-resistant and anti-corrosion coatings.

  • Research & Development: Functional thin films for advanced material studies.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures low contamination in films
Diameter25 – 300 mm (custom available)Fits different sputtering systems
Thickness3 – 6 mmInfluences sputtering rate & lifetime
Alloy CompositionTi/Zr/V = 1:1:1 at% (adjustable)Tailored film performance
BondingIndium, Copper, or Titanium backingImproves heat dissipation & stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
TiZrVStrong getter effect, stable coatingsUHV systems, semiconductors
TitaniumExcellent adhesion and durabilityDecorative films, microelectronics
ZirconiumHigh corrosion resistanceNuclear & chemical industries
VanadiumOxidation resistance, strengthSpecialty alloys, thin films

FAQ

QuestionAnswer
Can TiZrV targets be customized?Yes, composition, diameter, thickness, and bonding options are fully customizable.
What is the main use of TiZrV in vacuum systems?It serves as a non-evaporable getter (NEG) material, maintaining ultra-high vacuum by absorbing residual gases.
How are TiZrV targets packaged?Vacuum-sealed with protective foam, then shipped in export-safe cartons or wooden crates.
Which industries benefit most from TiZrV targets?Semiconductor, optics, aerospace, energy, and high-vacuum research labs.

Packaging

All Titanium Zirconium Vanadium Sputtering Targets are carefully labeled and securely packaged. Each piece is vacuum-sealed to protect against oxidation and mechanical damage, with additional cushioning materials and export-standard crates for safe international transport.

Conclusion

The Titanium Zirconium Vanadium (TiZrV) Sputtering Target is a versatile and high-performance material that combines the best properties of titanium, zirconium, and vanadium. Its unique functionality as a getter material, coupled with excellent film quality, makes it indispensable in advanced thin film and vacuum technologies.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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TiZrV target 3N ø50.8×5mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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