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trititanium-pentoxide-evaporation-materials

VD0735 Trititanium Pentoxide Evaporation Materials, Ti3O5

Catalog VD0735
Material Titanium Oxide (Ti3O5)
Purity 99%~99.99%
Shape Granules or tablets

At TFM, we specialize in the production and supply of high-purity trititanium pentoxide evaporation materials, as well as a diverse range of other evaporation products. Our trititanium pentoxide materials are available in both powder and granule forms, with customized options provided upon request to meet specific needs.

MSDS File

rititanium Pentoxide Evaporation Materials Overview

Trititanium pentoxide (Ti₃O₅) is a stable compound with metallic properties and high electrical conductivity at standard temperatures. This compound, part of the orthorhombic system, is widely used in vacuum coating materials for optoelectronic devices. TFM excels in producing trititanium pentoxide evaporation materials with purities of up to 99.9995%, ensuring exceptional stability and industry recognition in vapor deposition processes.

Related Products

  • Titanium Evaporation Materials
  • Oxide Ceramic Evaporation Materials

Specifications of Trititanium Pentoxide Evaporation Materials

Chemical formulaTi3O5
Purity2N-4N
AppearanceGranules or tablets
Melting point1760℃
Formula weight191.61
Size3-5mm or customized
ColorAtropurpureus

Applications of Trititanium Pentoxide Evaporation Materials

Trititanium pentoxide is utilized in various applications, including:

  • Beam Splitters
  • Cold Light Films
  • High Anti-Membrane Coatings
  • Glass Coatings

Packaging Information

Our trititanium pentoxide evaporation materials are meticulously packaged in plastic vacuum bags to avoid damage during storage and transportation, preserving the product’s quality. Each package includes a Certificate of Analysis (COA) to verify the material’s quality.

Contact Us

TFM specializes in providing high-purity trititanium pentoxide evaporation materials, ideal for semiconductor, chemical vapor deposition (CVD), and physical vapor deposition (PVD) applications. Our integrated approach, combining engineering, manufacturing, and analytical expertise, ensures we deliver top-tier evaporation materials. For more information or to make an inquiry, please contact us today.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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