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Tungsten Aluminum Boride Sputtering Target, WAlB₂

Introduction to Tungsten Aluminum Boride (WAlB₂) Sputtering Target

The Tungsten Aluminum Boride (WAlB₂) Sputtering Target is a specialized ceramic–metal composite material used for thin-film deposition. Composed of tungsten (W), aluminum (Al), and boron (B), this target combines the outstanding hardness and stability of borides with the refractory nature of tungsten and the oxidation resistance of aluminum. It is widely applied in producing durable coatings, protective layers, and multifunctional films for advanced industrial and research purposes.

Material Structure and Properties

  • Crystal Structure: WAlB₂ typically forms a hexagonal layered boride structure, where strong covalent B–B and metal–boron bonds ensure excellent hardness and stability.

  • Refractory Nature: Tungsten contributes a very high melting point (>3400 °C), thermal conductivity, and resistance to phase degradation.

  • Oxidation Resistance: Aluminum provides additional protection by forming stable Al₂O₃ layers at elevated temperatures.

  • Mechanical Strength: Boron enhances hardness, wear resistance, and structural integrity of the deposited film.

Key Features of WAlB₂ Sputtering Target

  • High Purity: Manufactured with purities up to 99.5–99.9%, ensuring minimal contamination in sputtered thin films.

  • Excellent Thermal & Chemical Stability: Stable under extreme deposition conditions and resistant to corrosion.

  • Versatile Sputtering: Suitable for both RF and DC magnetron sputtering systems.

  • Dense Microstructure: High density (>95% theoretical) targets ensure stable sputtering performance and high deposition rates.

Applications

The WAlB₂ sputtering target is employed in several cutting-edge industries where performance, stability, and durability are critical:

  1. Protective Coatings – Thin films with high hardness and wear resistance for tools, dies, and industrial components.

  2. Aerospace and Defense – Oxidation- and heat-resistant coatings for turbine blades, engine parts, and high-temperature components.

  3. Electronics & Semiconductors – Barrier layers, diffusion-resistant coatings, and conductive interconnects.

  4. Energy & Nuclear Applications – Radiation- and corrosion-resistant films suitable for extreme operating environments.

  5. Research and Development – Multifunctional boride films with tunable mechanical, electrical, and optical properties for new materials exploration.

Fabrication & Deposition

  • Target Manufacturing: Typically fabricated using solid-state reaction, hot-pressing, or spark plasma sintering (SPS) to achieve high density and mechanical robustness.

  • Film Characteristics: Sputtered films of WAlB₂ show high hardness, oxidation resistance, and thermal stability, while maintaining good adhesion and uniformity on substrates.

  • Deposition Compatibility: Works well with magnetron sputtering (RF/DC) and pulsed laser deposition (PLD) systems.

Order Now

WAlB₂ target (W/Al/B = 1/1/2 at%) 99.95% ø50.8×3mm, WAlB₂ target (W/Al/B = 1/1/2 at%) 99.95% ø50.8×5mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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