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Tungsten Diselenide Evaporation Materials

VD0854 Tungsten Diselenide Evaporation Materials, WSe2

Catalog No.VD0854
MaterialTungsten Selenide (WSe2)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier manufacturer and supplier specializing in high-purity tungsten diselenide evaporation materials. Our extensive range of evaporation materials is available in both powder and granule forms. We also offer tailored solutions to meet specific needs, with custom forms available upon request.

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Tungsten Diselenide Evaporation Materials Overview

Tungsten diselenide (WSe2) is a high-purity ceramic evaporation material designed for precision in deposition processes. This material plays a crucial role in ensuring the quality of deposited films, making it essential for various high-tech applications. At TFM, we offer tungsten diselenide with purity levels reaching up to 99.9995%, adhering to rigorous quality assurance processes to ensure exceptional product reliability.

Specifications of Tungsten Diselenide Evaporation Materials

Material TypeTungsten diselenide
SymbolWSe2
Appearance/ColorGrey to black solid
Melting Point> 1200 °C
Density9.32 g/cm3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications of Tungsten Diselenide Evaporation Materials

Tungsten diselenide is widely used in various deposition techniques including:

  • Semiconductor Deposition: Critical for manufacturing semiconductor components.
  • Chemical Vapor Deposition (CVD): Utilized in creating thin films with precise properties.
  • Physical Vapor Deposition (PVD): Employed in coating processes to enhance material properties.

Additionally, it is used in optics for:

  • Wear Protection: To enhance the durability of optical components.
  • Decorative Coatings: For aesthetic applications in various industries.
  • Displays: In technologies requiring high-quality visual outputs.

Packaging and Handling

Our tungsten diselenide materials are meticulously packed to prevent any damage during storage and transport, ensuring they arrive in optimal condition. Each package is designed to maintain the integrity and quality of the material.

Contact Us

TFM is dedicated to producing high-quality evaporation materials suitable for a range of applications including semiconductors, CVD, PVD, and optical technologies. We offer a wide array of materials, including pure metals, alloys, and various ceramics.

For the latest pricing information or inquiries about materials not listed, please reach out to us directly. Our team is ready to assist you with any questions or special requests you may have.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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