Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
tungsten-sulfide-evaporation-materials-1-1-1

VD0827 Tungsten Disulfide Evaporation Materials, WS2

Catalog No.VD0827
MaterialTungsten Sulfide (WS2)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM is a premier manufacturer and supplier of high-purity tungsten disulfide evaporation materials, along with a broad range of other evaporation products. Our tungsten disulfide materials are available in both powder and granule forms, with the option for customized configurations to meet specific requirements. Reach out to TFM for tailored solutions designed to support your unique deposition processes.

MSDS File

Tungsten Disulfide Evaporation Materials Overview

TFM offers tungsten disulfide (WS2) evaporation materials, a high-performance sulfide ceramic ideal for use in various deposition processes. The superior purity of these materials, reaching up to 99.9995%, ensures the production of high-quality thin films. TFM employs rigorous quality control methods, ensuring the reliability and consistency of every product.

Related Products

Tungsten Disulfide Evaporation Materials Specifications

Material TypeTungsten Disulfide (WS2)
Appearance/ColorBlue-gray Solid
Melting Point1,250 °C (2,280 °F; 1,520 K), decomposes
Density7.5 g/cm³
Purity99.5% – 99.9%
ShapePowder, Granules, or Custom-made

Applications of Tungsten Disulfide Evaporation Materials

Tungsten disulfide (WS2) is widely utilized in deposition processes such as semiconductor fabrication, chemical vapor deposition (CVD), and physical vapor deposition (PVD). Its excellent properties make it ideal for optical applications, including protective coatings, decorative finishes, and display technologies.

Packaging and Handling

Each batch of tungsten disulfide evaporation materials is carefully packaged, labeled, and tagged to facilitate easy identification and maintain product integrity. TFM takes special precautions to ensure safe transport and storage, reducing the risk of any damage during shipment.

Contact TFM for Custom Orders and Pricing

As a leading supplier, TFM offers a wide range of high-purity tungsten disulfide evaporation materials in various shapes such as granules, powder, rods, and custom configurations. For tailored orders or to inquire about pricing, including materials not listed, contact TFM directly. Additionally, TFM supplies evaporation sources, crucibles, filaments, heaters, and e-beam crucible liners to complement these materials.

Reviews

There are no reviews yet.

Be the first to review “VD0827 Tungsten Disulfide Evaporation Materials, WS2”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

Shopping Cart
Scroll to Top