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tungsten-ditelluride

VD0870 Tungsten Ditelluride Evaporation Materials, WTe2

Catalog No.VD0870
MaterialTungsten Telluride (WTe2)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM stands at the forefront of the industry as a distinguished manufacturer and supplier of high-purity tungsten ditelluride evaporation materials. We specialize in providing a comprehensive range of evaporation materials, available in both powder and granule forms. Additionally, we offer custom solutions tailored to your specific needs. Whether you require standard or bespoke materials, TFM is dedicated to delivering excellence and precision.

MSDS File

Tungsten Ditelluride Evaporation Materials Overview

Tungsten ditelluride, with the chemical formula WTe₂, is a specialized evaporation material utilized in various deposition techniques. Known for its high-purity, TFM offers tungsten ditelluride materials that are crucial for achieving superior quality in thin film deposition processes. Our commitment to excellence ensures that these materials meet up to 99.9995% purity, delivering reliable and consistent performance for your needs.

Specifications of Tungsten Ditelluride Evaporation Materials

Material TypeTungsten Ditelluride
SymbolWTe2
Appearance/ColorGray crystals
Melting Point1,020 °C (1,870 °F; 1,290 K)
Density9.43 g/cm3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications of Tungsten Ditelluride Evaporation Materials

Tungsten ditelluride evaporation materials are integral to various deposition methods, including:

  • Semiconductor Deposition: Essential for producing high-performance semiconductor devices.
  • Chemical Vapor Deposition (CVD): Used for creating thin films in a controlled environment.
  • Physical Vapor Deposition (PVD): Ideal for applications requiring precise coating.
  • Optical Coatings: Employed in wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

Our tungsten ditelluride evaporation materials are meticulously packaged in vacuum-sealed plastic bags to ensure their integrity during storage and shipping. Each package includes a Certificate of Analysis (COA) to verify the quality and purity of the material.

Contact Us

At TFM, we pride ourselves on our advanced engineering and manufacturing capabilities. Our tungsten ditelluride evaporation materials are designed to meet the highest industry standards for use in a variety of applications, from semiconductors to optical coatings. For more information or to request a quote, please reach out to us today.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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