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Tungsten Doped Indium Oxide Sputtering Target

ST0885 Tungsten Doped Indium Oxide Sputtering Target, IWO

Tungsten Doped Indium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

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Tungsten Doped Indium Oxide Sputtering Target Description

Tungsten-doped indium oxide sputtering target is used in sputtering processes, a physical vapor deposition technique commonly employed in the semiconductor industry to deposit thin films of materials onto substrates.

The addition of tungsten (W) to the indium oxide matrix enhances the electrical and optical properties of ITO thin films, increasing conductivity and improving light transmission. Tungsten doping also enhances the stability and durability of ITO coatings.

Related Product:  ITO Sputtering Target

Tungsten Doped Indium Oxide Sputtering Target Specifications

Compound FormulaIn2O3/ WO3
AppearanceGray, Semi-Metallic
Melting Point1980℃
Density2.329 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Tungsten Doped Indium Oxide Sputtering Target Handling Notes

Indium bonding is recommended for Tungsten Doped Indium Oxide Sputtering Targets due to the material’s brittleness and low thermal conductivity. These characteristics can make it susceptible to thermal shock during sputtering.

Tungsten Doped Indium Oxide Sputtering Target Application

Tungsten Doped Indium Oxide Sputtering Target is typically used in applications requiring high-quality thin films, such as in the fabrication of integrated circuits, solar cells, optical coatings, and various electronic and semiconductor devices.

Tungsten Doped Indium Oxide Sputtering Target Packaging

Our Tungsten Doped Indium Oxide Sputtering Targets are meticulously handled during storage and transportation to maintain their quality and ensure they arrive in optimal condition.

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TFM offers Tungsten Doped Indium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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