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tungsten-oxide

VD0738 Tungsten(VI) Oxide Evaporation Materials, WO3

Material Type：Tungsten Oxide
Symbol：WO3
Color/Appearance：Lemon Yellow, Solid
Purity: 99.9%
Shape: Powder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity tungsten(VI) oxide evaporation materials, along with an extensive range of other evaporation materials. We provide these materials in both powder and granule form, ensuring flexibility for various applications. For specific requirements, we also offer customized forms upon request, tailored to meet your unique needs.

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Tungsten(VI) Oxide Evaporation Materials Overview

TFM offers high-purity tungsten(VI) oxide (WO3) evaporation materials, widely used in various deposition processes to achieve high-quality film layers. With a chemical formula of WO3, these materials play a critical role in ensuring precision and reliability. TFM specializes in producing tungsten(VI) oxide with up to 99.9995% purity, adhering to strict quality control standards to guarantee the reliability of the final product.

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Tungsten Evaporation Materials

Tungsten(VI) Oxide Evaporation Materials Specification

Material TypeTungsten(VI) Oxide
SymbolWO3
Appearance/ColorLemon Yellow, Solid
Melting Point1,473 °C (2,683 °F; 1,746 K)
Density7.16 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications of Tungsten(VI) Oxide Evaporation Materials

Tungsten(VI) oxide evaporation materials serve a range of advanced applications, including:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Coatings: Used in wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Quality Assurance

All tungsten(VI) oxide evaporation materials from TFM are carefully packaged and labeled for clear identification and efficient quality control. To ensure the product’s integrity, precautions are taken to avoid any damage during transportation and storage.

Contact and Customization

TFM is a premier supplier of high-purity tungsten(VI) oxide evaporation materials available in various forms, such as tablets, granules, rods, and wires. Custom shapes and quantities are also available upon request. Additionally, TFM supplies a full range of evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For inquiries about pricing or other materials not listed, please reach out to TFM for further details.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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