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ST0315 Tungsten Selenide Sputtering Target, WSe2

Chemical Formula: WSe2
Catalog Number: ST0315
CAS Number: 12067-46-8
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tungsten Selenide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

CoA_WSe2

Tungsten Selenide Sputtering Target

Introduction

The Tungsten Selenide (WSe₂) Sputtering Target from Thin Film Materials (TFM) is a high-purity compound sputtering material widely used in semiconductors, optoelectronics, and energy devices. Tungsten selenide is a member of the transition metal dichalcogenide (TMD) family, known for its layered crystal structure and tunable electronic and optical properties. When fabricated into sputtering targets, WSe₂ enables the deposition of uniform thin films that are essential for advanced research and device engineering.

Detailed Description

WSe₂ sputtering targets are engineered to deliver high density, uniform grain size, and exceptional film quality. With typical purities ranging from 99.9% (3N) to 99.99% (4N), they provide excellent control of stoichiometry and minimize film contamination.

  • Chemical Formula: WSe₂

  • Appearance: Dark gray to black crystalline solid

  • Crystal Structure: Hexagonal layered structure (similar to MoS₂)

  • Density: ~9.32 g/cm³

  • Melting Point: ~1,550 °C (decomposes before melting in air)

TFM supplies WSe₂ sputtering targets in disc, rectangular, and step target formats. Bonding services with copper or titanium backing plates are available to improve thermal management and mechanical stability during deposition. Custom shapes and dimensions can be provided upon request.

Applications

Tungsten Selenide sputtering targets are widely applied in:

  • Semiconductors: 2D materials for transistors, FETs, and integrated circuits

  • Optoelectronics: thin films for photodetectors, LEDs, and sensors

  • Solar energy: absorber layers in next-generation photovoltaic devices

  • Thermoelectrics: thin films for energy conversion and heat management

  • Research: advanced studies on layered TMDs for quantum and nanoelectronics

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures high film quality and stability
Diameter25 – 150 mm (custom up to 300 mm)Compatible with most sputtering systems
Thickness3 – 6 mmControls sputtering rate and uniformity
Bonding OptionsIndium / ElastomerImproves adhesion and thermal stability
Backing PlateCopper / TitaniumProvides better heat dissipation and durability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
WSe₂Layered 2D semiconductor propertiesTransistors, solar cells, optoelectronics
MoS₂High electron mobilityElectronics, lubrication films
WS₂Strong mechanical & optical stabilityOptoelectronics, photonics

FAQ

QuestionAnswer
Can WSe₂ sputtering targets be customized?Yes, TFM offers custom diameters, thicknesses, purity levels, and bonding options.
Do you provide bonded targets?Yes, indium and elastomer bonding are available for enhanced durability and performance.
How are WSe₂ targets packaged?Each target is vacuum-sealed, cushioned with foam, and shipped in export-safe cartons or crates.
Which industries use WSe₂ targets most?Semiconductor, photovoltaic, sensor, and advanced R&D fields.

Packaging

All Tungsten Selenide sputtering targets are vacuum-sealed and securely packaged to prevent oxidation, moisture exposure, and mechanical damage. Export-safe cartons or wooden crates are used to ensure safe transport.

Conclusion

The Tungsten Selenide (WSe₂) Sputtering Target from TFM provides high purity, reliable performance, and customizable options for thin film deposition. With its unique layered structure and tunable properties, WSe₂ is a critical material for next-generation electronics, energy, and photonic devices.

For detailed specifications, quotations, and tailored solutions, please contact us at sales@thinfilmmaterials.com.

Order Now

WSe₂ Target 99.99% ø50.8×6.35mm, WSe₂ target 3N Ø76.2×3mm Indium Bonded to Cu B/Plate Ø76.2/85.75×3.85mm, WSe₂ target 4N 2"×3 mm In Bonded 2 mm Cu B/Plate

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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