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V41 Series: Remote Plasma Control Valves

Applications

  • High Vacuum Processes
  • Chemical Vapor Deposition (CVD) Processes: Includes Metal Organic (MO), Plasma Enhanced (PE), High-Density Plasma (HDP), Low-Pressure (LP), and Atomic Layer Deposition (AP).
  • Photovoltaic and Semiconductor Applications

Features

  • Pneumatic Actuator: Equipped with position indicators.
  • Triple O-Ring Shaft Seal: Provides primary and secondary vacuum seals, along with a tertiary pneumatic seal.
  • Grease Counter Flow Pocket: Combined with the upper piston seal to significantly reduce particle generation.
  • Durable Lifecycle: Over 1 million cycles and easy maintenance minimize overall ownership costs.
  • Standard Sizes: Available in ISO-KF 16 and 25.

Options

  • Custom Sizes: Tailored to specific requirements.
  • Variety of O-Ring Compounds: Includes options like Kalrez®, Chemraz®, and more.

Specifications Table

Temperature (°C)Valve body: 150°C
Valve actuator: 100°C
Pressure Range (torr)1 X 10-8 mbar – ATM
Differential Press (torr)≤ 1.5 bar in either direction
MaterialValve body, bonnet seal, gate: AL6061
Valve actuator: AL6061
Seal MaterialFluorocarbon (option KALREZ, ETC)
Leak Rate (cc/sec)<1 X 10-8 mbar. l/s
Cycles Until Service (approx.)≥ 1 million
Position IndicatorSMC D-A93
OperationDouble acting

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FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

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