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VD0656 Vanadium Aluminum Evaporation Materials, V/Al

Catalog No.VD0656
MaterialVanadium Aluminum (V/Al)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) is a premier provider of high-purity vanadium and aluminum evaporation materials, along with an extensive range of other evaporation products. Our offerings include both powder and granule forms, and we also provide customized solutions tailored to your specific needs.

MSDS File
Vanadium-Aluminum Evaporation Materials Overview

Vanadium-aluminum evaporation materials from Thin-Film Mat Engineering (TFM) are specialized alloys composed of vanadium (V) and aluminum (Al). These high-purity materials, with purity levels reaching up to 99.9995%, are critical in achieving superior quality in thin-film deposition processes. TFM employs rigorous quality assurance methods to ensure the reliability and performance of these materials.

Applications

Vanadium-aluminum evaporation materials are versatile and used in various applications, including:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Coatings: Suitable for wear-resistant coatings, decorative finishes, and display applications.

Packaging

To ensure optimal quality and ease of handling, vanadium-aluminum evaporation materials are carefully packaged. Each package is clearly labeled to facilitate identification and maintain quality control throughout storage and transportation.

Contact Us

Thin-Film Mat Engineering (TFM) offers a range of vanadium-aluminum evaporation materials in different forms, such as tablets, granules, rods, and wires. We also provide custom solutions tailored to specific requirements. In addition to our evaporation materials, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or inquiries about materials not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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